Title:

Ball Bond Strength Improvement Through Capillary Design Optimization

Author(s):

Warren Amparo and Roel Birung, Analog Devices (Phils.), Inc.

Gist:

Wirebonding capillary design is identified as a significant process variable influencing bondability. This study involves optimization of critical capillary dimensions to attain a more efficient and more consistent application of ultrasonic energy during wirebonding. Critical capillary dimensions relevant to bondability are chamfer diameter and chamfer angle. These dimensions determine the amount of free air ball held by the capillary during application of ultrasonic energy. The study revealed that the application of bigger capillary chamfer diameter and lower chamfer angle significantly improves the ball chear strength of the bonds due to better grip on the ball bond during the application of ultrasonic energy.

Published in :

ASEMEP 2001 Proceedings; June, 2001