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Gold-silicon alloys have traditionally been used to attach the silicon die to ceramic substrates in hermetic packages, one advantage of which is zero moisture absorption of metal solders. In such a system, however, the interaction between thermal mismatch and high modulus of rigidity of the die attach material can result in silicon die fractures. A new polymer thermoset cyanate ester die attach paste was evaluated in this study, which showed that this polymeric die attach material, when used in multi-layered ceramic packages, has significant advantages over eutectic die attach in terms of assembly yields and electrical performance.
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