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The continuous increase in customers' demand for both thin and thick film hybrid amplifier modules when this paper was written necessitated a corresponding increase in production capacity. To address the wirebonding capacity constraints, this study focused on the feasibility of transitioning from wedge-wedge bonding to a gold ball thermosonic stitch wire bonding process, given the inherent speed associated with ball bonding. Concerns addressed were: adaptibility of the existing set-ups to adapt to a ball-stitch-stitch bonder, proper selection of the bonding tool, wire bonding parameter optimization, process efficiency and repeatability, productivity, and product quality and reliability. This study concluded that gold ball thermosonic stitch bonding in hybrid modules intended for high frequency applications is feasible.
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