|
Alloy |
Melting Temp.(oC) |
Application |
Advantages/Disadvantages |
|
80Au-20Sn |
280 |
Die
attachment; Chip packaging. |
High thermal conductivity and
creep resistance/
expensive. |
|
88Au-12Ge |
356 |
Die
attachment; Chip packaging. |
High thermal conductivity and
creep resistance/
expensive. |
|
97Au-3Si |
370 |
Die
attachment; Chip packaging. |
High thermal conductivity and
creep resistance/
expensive. |
|
97.5Pb-1Sn-1.5Ag |
309 |
Die
attachment; Chip packaging. |
It is a eutectic alloy having
fast heat response/
contains Pb. |
|
63Sn-37Pb |
183 |
Die
attachment; Chip and board packaging. |
The most widely used in PCB
packaging having fast heat response and high wetting power;
reliability well established/ contains Pb. |
|
62Sn-36Pb-2Ag |
179 |
Die
attachment; Chip and board packaging. |
Widely used in PCB packaging
having fast heat response and high wetting power and compatible
with Ag metallization/ contains Pb. |
|
97.3Bi-2.5Ag-0.2Cu |
260 |
Die
attachment. |
High temperature packaging
ability and low cost/ no
reliability study. |
|
96.5Sn-3.5Ag |
221 |
Die
attachment; Chip and board packaging. |
Widely targeted as a PCB
packaging solder and reliability well established / melting temperature
still relatively high. |
|
99.3Sn-0.7Cu |
227 |
Die
attachment; Chip and board packaging. |
Widely targeted as a PCB wave
soldering solder and reliability well established / melting temperature
still relatively high. |
|
94.7Sn-3.3Ag-2Cu |
217 |
Die
attachment; Chip and board packaging. |
The most widely targeted as a
PCB packaging solder and very stable eutectic point/
melting temperature
still relatively high. |
|
58Bi-42Sn |
138 |
Temperature sensitive device packaging. |
Targeted as low cost PCB
packaging solder and reliability well established / plasticity
still relatively low. |
|
52In-48Sn |
118 |
Temperature sensitive device packaging. |
Will absorb package thermal
strain due to its low strength and high ductility/ expensive. |
