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ACRONYMS in the Semiconductor Industry

   

8-D Report

8 Disciplines Report

ADC

Analog-to-Digital Converter

AIAG

Automotive Industry Action Group

AQL

Acceptable Quality Level

ASEMEP

Association of Semiconductor and Electronics Manufacturing Engineers of the Philippines

ASIC

Application-Specific Integrated Circuit

ASTM

American Society for Testing and Materials

AVL

Approved Vendors List

BD

Bonding Diagram

BGA

Ball Grid Array

BiCMOS

Bipolar Complementary Metal Oxide Semiconductor

BPSG

Boro-Phospo-Silicate Glass

BSE

Back-Scattered Electrons

BST

Ball Shear Test

CAR

Corrective Action Request

CDM ESD

Charged Device Model Electrostatic Discharge

CerDIP

Ceramic Dual In-line Package

CMOS

Complementary Metal Oxide Semiconductor

COL

Chip On Lead

CSAM

C-mode Scanning Acoustic Microscopy

CSP

Chip Scale Package

DAC

Digital-to-Analog Converter

DCAS

Defense Contract Administration Service

DESC

Defense Electronic Supply Center

DFM

Design For Manufacturability

DFP

Dual Flat Pack

DFR

Design For Reliability

DFT

Design For Test

DIP

Dual In-line Package

DJS

Diminishing JAN Source

DO

Diode Outline

DOE

Design of Experiments

DPM

Defects Per Million (referring to the defects)

DPM

Defectives Per Million (referring to the defective products)

DRAM

Dynamic Random Access Memory

DRC

Design Rules Check

DSP

Digital Signal Processing

ECTC

Electronic Components and Technology Conference

EDX or EDAX

Energy Dispersive X-ray

EEPROM

Electrically Erasable Programmable Read Only Memory

EIA

Electronic Industries Alliance

EIAJ

Electronics Industry Association of Japan

ELF

Early Life Failure

EOS

Electrical Overstress

EPI

Epitaxial Layer

EPROM

Erasable Programmable Read Only Memory

ERC

Electrical Rules Check

ESCA

Electron Spectroscopy for Chemical Analysis

ESD

Electrostatic Discharge

ESDS

ESD Sensitivity

FA

Failure Analysis

FCOL

Flip Chip on Lead

FET

Field Effect Transistor

FIB

Focused Ion Beam

FICDM ESD

Field-Induced Charged Device Model ESD

FMEA

Failure Modes and Effects Analysis

FTIR

Fourier Transform Infrared

GSI

Government Source Inspection

HAST

Highly Accelerated (Temperature Humidity) Stress Test

HBM ESD

Human Body Model Electrostatic Discharge

HSA

High Speed Amplifier

HSC

High Speed Converter

HTOL

High Temperature Operating Life

HTS

High Temperature Storage

IC

Integrated Circuit

ICT

In-Circuit Test

IEEE

Institute of Electrical and Electronics Engineers

IF

Intermediate Frequency

IGBT

Insulated Gate Bipolar Transistor

IGFET

Insulated Gate Field Effect Transistor

ILD

Inter-Layer Dielectric

ILS

In-Line Sampling

IMAPS

International Microelectronics and Packaging Society

IMD

Inter-Metal Dielectric

IPC

renamed to: Association Connecting Electronic Industries

ISM

Industrial, Scientific, Medical

ISO

International Organization for Standardization

ISTFA

International Symposium for Testing and Failure Analysis

JAN (J)

Joint Army/Navy

JANS (JS)

Joint Army/Navy - most Stringent Reliability Test

JANTX (JTX)

Joint Army/Navy with extra testing requirements

JANTXV (JTXV)

JANTX with Visual Inspection requirements

JEDEC

Joint Electron Device Engineering Council

JFET

Junction Field Effect Transistor

JLCC

J-Leaded Chip Carrier

JTAG

Joint Test Action Group

LAT

Lot Acceptance Test

LCC

Leadless Chip Carrier

LEM

Light Emission Microscopy

LFCSP

Leadframe Chip Scale Package

LIMS

Laser Ionization Mass Spectroscopy

LQFP

Low Profile Quad Flat Pack

LSI

Large Scale Integration

LTOL

Low Temperature Operating Life

LTPD

Lot Tolerance Percent Defective

MCM

Multichip Module

MCP

Multichip Package

MEMS

Micromachined ElectroMechanical Systems

MET

Metal Layer

MIC

Mobile Ionic Contamination

MIL

Military Specification

MIL-STD

Military Standard

MM ESD

Machine Model Electrostatic Discharge

MOS

Metal Oxide Semiconductor; PMOS (p-channel); NMOS (n-channel)

MQFP

Metal Quad Flat Pack

MRB

Material Review Board

MSDS

Material Safety Data Sheets

MSI

Medium Scale Integration

MSL

Moisture Sensitivity Level

MSP

Mixed Signal Processing

MSOP

Micro Small Outline Package

MTBA

Mean Time Before Assist

MTBF

Mean Time Before Failure

MTTF

Mean Time To Failure

NDBP

Non-destructive Bond Pull

NEMI

National Electronics Manufacturing Initiative

NPN

Negative/Positive/Negative Bipolar Transistor

OCAP

Out-of-Control Action Plan

OEM

Original Equipment Manufacturer

PCT

Pressure Cooker Test

PDA

Percent Defective Allowable

PDIP

Plastic Dual In-line Package

PGA

Pin Grid Array

PIND

Particle Impact Noise Detection

PLCC

Plastic Leaded Chip Carrier

PLL

Phase Locked Loop

PNP

Positive/Negative/Positive Bipolar Transistor

POLY

Polysilicon

PPM

Parts Per Million

PROM

Programmable Read-Only Memory

PSOP

Power Small Outline Package

PQFP

Plastic Quad Flat Pack

QCI

Quality Conformance Inspection

QFP

Quad Flat Pack

QM

Quality Management

QML

Qualified Manufacturer Listing

QPL

Qualified Parts List

Q&R

Quality and Reliability

QSOP

Quarter-size Small Outline Package

RAM

Random Access Memory

RF

Radio Frequency

RGA

Residual Gas Analysis

RHA

Radiation Hardness Assurance

ROM

Read-Only Memory

SAM

Scanning Acoustic Microscopy

SCDM

Socketted Charged Device Model

SCR

Silicon Controlled Rectifier

SDIP

Shrink Dual In-line Package

SEC

Standard Evaluation Circuit

SEM

Scanning Electron Microscope

SHRT

Solder Heat Resistance Test

SIMS

Secondary Ion Mass Spectroscopy

SIP

Single In-line Package

SIP or SIAP

System in a Package

SJR

Solder Joint Reliability

SMD

Standardized Military Drawing

SMD

Surface Mount Device

SMT

Surface Mount Technology

SOC

System on a Chip

SOG

Spin On Glass

SOI

Silicon on Insulator

SOIC

Small Outline Integrated Circuit

SOJ

J-Leaded Small Outline Package

SOT

Small Outline Transistor

SPC

Statistical Process Control

SRAM

Static Random Access Memory

SSI

Small Scale Integration

SSOP

Shrink Small Outline Package

ST

Solderability Test

TEM

Transmission Electron Microscope

THB

Temperature Humidity Bias

TO

Transistor Outline

TCI

Technology Conformance Inspection

TCV

Technology Characterization Vehicle

TDDB

Time Dependent Dielectric Breakdown

TFP

Triple Flat Pack

TQFP

Thin Quad Flat Pack

TQM

Total Quality Management

TRB

Technical Review Board

TRIAC

Triode AC Switch

TSOP

Thin Small Outline Package

TSSOP

Thin Shrink Small Outline Package

VLSI

Very Large Scale Integration

VSOP

Very Small Outline Package

W-CSP

Wafer-level Chip Scale Package

WDX

Wavelength Dispersive X-ray

WPT

Wire Pull Test

      

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