|
Semiconductor
Packaging / Assembly Equipment
Die
Attach Equipment
Die attach
machines
or
die bonders
(Fig. 1) are used to
mount or
attach the die to the die pad or die
cavity of the support structure of the package. A typical die attach machine consists of a system for
holding and
indexing the leadframes
or packages on which the dice will be mounted, a system for
dispensing
the
die attach
material
on the die pad or die cavity, and a pick and place system for
ejecting
a die from the wafer,
picking
it, and
positioning
it on the dispensed die attach material. Alphasem,
ESEC, and K&S are examples of manufacturers of die bonders. See also
Die Attach process.
Figure 1.
Examples of Die Bonders
Wirebonders
Wirebond
machines or
wirebonders
are used to
connect
electrically
the die of the device to the
leads of the package using
very fine wires. A typical wirebonder consists of a system for
holding and indexing the leadframes or packages for wirebonding, a system for
ensuring that the units are at the
right temperature
during wirebonding, and
a system for
connecting the wires from the die to the bonding fingers of
the leadframe or bonding posts of the package. ESEC,
ASM, Kaijo, and K&S are examples of manufacturers of wirebonders. See also
Wirebond process.
Figure 2.
Examples of Wirebonders
Molding
Equipment
A typical
molding
equipment
for encapsulating integrated circuits consists of a preheating chamber, a
plunger system, a melting pot, runners, and molding cavities.
The
preheating chamber
is where the molding compound is preheated prior to
being melted. The
plunger system forces the preheated molding
compound into the melting pot. The melting pot
is where the mold
compound reaches
melting temperature and becomes fluid. The plunger system also forces the fluid molding compound
from the melting pot into the runners. These
runners
serve
as canals where the fluid molding compound travels until it reaches the
cavities, which contain the leadframes for encapsulation. Sumitomo,
Lauffer, and Towa are examples of manufacturers of molding equipment.
See also
Molding process.
Figure 3.
Example of an Automold system
<Proceed to Page 2 - DTFS and Lead Finish
Equipment>
See Also:
Semiconductor
Eqpt;
Wafer Fab Equipment;
Test
Equipment;
Assembly
Accessories;
IC
Manufacturing
Home
Copyright
©
2001-2005
www.SiliconFarEast.com.
All Rights Reserved. |
