Common Wafer Backgrind-related Failure Mechanisms

Common Wafer Backgrind-related Failure Mechanisms:

Die Cracking/Chipping - occurrence of fracture or chip-out anywhere in the die. Common Causes in the context of Backgrind: incorrect backgrind parameters resulting in excessive stresses on the wafer

Die Scratching - inducement of any mechanical damage on the die, as when an operator scratches a die with tweezers due to mishandling. Common Causes: insufficient operator training, disorderly workplace, use of improper tools

Die Metallization Smearing - depression or deformation of any metal line on the die surface. Common Causes: foreign materials on the backgrind tape, wafer mishandling

Die Corrosion - corrosion of the metallic parts of the die as a result of prolonged exposure to water during backgrinding

Front-End Assembly Links: Wafer Backgrind; Die Preparation; Die Attach; Wirebonding; Die Overcoat

Back-End Assembly Links: Molding; Sealing; Marking; DTFS; Leadfinish

See Also: IC Manufacturing; Assembly Equipment

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