CCGA - Ceramic Column Grid Array

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The Ceramic Column Grid Array, or CCGA, is a square-shaped or rectangular ceramic package that uses solder columns for external electrical connection instead of leads or solder balls. These solder columns are arranged in a grid or array at the bottom of the ceramic package body, hence the name 'ceramic column grid array'. The CCGA is basically just a CBGA package that has solder columns instead of solder balls.

The main advantage of CCGA over CBGA is the higher reliability of the solder columns compared to solder balls. The columns provide a higher package stand-off and structural flexibility, allowing the CCGA to adapt to CTE mismatches with the PCB more easily than CBGA's.

The CCGA package is designed for high I/O applications, with column counts typically ranging from 191 to 2577. Column pitch (distance between solder columns) values typically used by the CCGA package are 1.0 mm and 1.27 mm. Typical CCGA body sizes range from 14 mm square to 52.5 mm square. The height of the solder column from the ceramic body of the CCGA is typically either 1.27 mm or 2.2 mm.

Table 1. Properties of Some CCGA's

No. of Columns	Body Size	Package Thickness	Column Pitch
376	27.94 mm x 27.94 mm	2.79 mm	1.27 mm
376	27.94 mm x 27.94 mm	2.79 mm	1.27 mm
624	32.5 mm x 32.5 mm	2.5 mm	1.27 mm
1152	35 mm x 35 mm	3 mm	1.0 mm
1272	37.5 mm x 37.5 mm	3 mm	1.0 mm

Figure 1. Example of a CCGA
Figure 2. Solder columns of a CCGA

See also: Ball Grid Array (BGA); CBGA

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