The Ceramic Dual In-line Package, or CerDIP is one of the most mature IC packages still in use today.  It is a rectangular ceramic package that has leads extending from both of its longer sides, thus forming two sets of in-line pins. 

The CerDIP is a hermetically sealed package that keeps out moisture and contaminants once it is sealed. The CerDIP package is composed of an upper part called the cap, and a lower part called the base.  The base has a cavity where the microchip is mounted.  The base is covered by the cap and then sealed with molten seal glass.  The seal glass provides a good hermetic seal once it has cooled down and solidified, which is why hermetic packages such as the CerDIP are used in military grade devices.

CerDIP lead counts range from 8 to 40.  CerDIP's typically come in two body widths:  the narrow body which is typically slightly less than 300 mils wide and the wide body which is typically slightly less than 600 mils wide.  The lead pitch of a cerdip package is typically 100 mils.

Table 1. Properties of Some Examples of CerDIP's

   

Figure 1.  Example of a CerDIP

See more IC Package Types