DCI's Description of their Product Offerings:

We offer test socket and contactor solutions for CSP, BGA, PGA and QFP devices in the semiconductor test industry... and a broad product range-from sockets for RF micro lead frame packages to high-speed ASICs with more than 1,000 pins.... We utilize all current contact technologies such as low inductance micro pogo pins, elastomers and etched microstrip, and can adapt the contact technology most suited to our customers' needs.

DCI's Description of their Design Process:

Our socket design process covers several rigorous phases. We use state-of-the-art computer-aided design (CAD) tools, including 3D mechanical modeling. After customer approval of designs, the product goes into computer-aided manufacturing (CAM). Finally, we conduct a range of stringent performance verification tests-from a simple point-to-point continuity test to a complete characterization of the socket's resistance, capacitance, inductance, bandwidth and crosstalk.

DCI's Description of their Advantages:

-  Highest first pass yield - solid reliable contact

-  Lowest cost of test - sockets typically last beyond 200,000 insertions and are easily maintained

-  Quick-turn design - 3D Modeling software with standardized configurations

-  10 years of contactor design and tester interface experience

-  Reduced time to production - same socket for characterization and final test

DCI's Description of their Capabilities:

-  Fine pitch sockets to 0.3mm

-  RF sockets with center ground contacts; DC to >10GHz, <0.1nH self-inductance

-  Strip contactors for testing prior to part singulation

-  Multi-site sockets for parallel testing to 64 devices

-  E-Beam sockets for Schlumberger IDS systems

-  Handler specific contactors for Delta, Seiko-Epson, Daymark

-  Characterization sockets for evaluation boards

K&S's Description of their Product Offerings:

K&S is a leading designer and producer of high performance test sockets and contactors. We have designed and produced DUT (Device Under Test) test sockets for the smallest chip scale packages, with less than 100 contacts, and for the largest microprocessors, with over 1,000 contacts. And our test sockets handle pitches as tight as 0.4 mm.

K&S's Description of their Design Process/Capabilities:

The test socket design process is highly automated and progresses from computer-aided design (CAD), which may include 3D electrical and mechanical modeling, to computer-aided manufacturing (CAM). Performance verification testing ranges from a simple point-to-point continuity test to a complete characterization of the socket's resistance, capacitance, inductance, bandwidth and crosstalk....

We use a combination of design techniques - including spring-loaded probe contacts, a floating base, and package specific inserts - to gently guide DUT package contacts into position while socket contacts and other mechanical seating devices adjust and follow. This prevents damage to the IC package during manual or automated actuation, and ensures that contact force is distributed uniformly....

We design a variety of spring-loaded probe contacts to meet different performance parameters. And because our contacts are separate and independent from each other, low-inductance contacts that deliver high-speed signals without degrading edge rates (rise and fall times) can be placed along side higher-inductance contacts for power signals. Separate, independent contacts also decrease crosstalk.