- questions most frequently asked by visitors of www.siliconfareast.com
to Package Delamination
What failure mechanisms can arise from the presence of internal package
Delamination, or the separation between two supposedly connected layer
interfaces within a package, is generally considered more as a failure attribute rather
than as a failure mechanism, i.e., its presence in a package doesn't
necessarily mean a failure. Its presence, however, has to be considered
a valid package failure if its size, location, shape, or any other
characteristic poses a reliability risk in the field, i.e., it can cause
the device to fail by a secondary failure mechanism.
failure mechanisms that arise from the presence of delamination include
die corrosion, package cracking, bond lifting, and breaking of the neck
or heel of a bond.
Device-related failures such as parametric shifts due to internal
contamination can also be induced by package delamination.
is often addressed in the context of which layer interfaces are
involved. As such, die-to-mold delamination is often treated
differently from leadframe-to-mold delamination, since they result in
different failure mechanisms and require different corrective actions
a die-to-mold delamination can cause the molding compound to move
laterally with respect to the die surface, which can either cause ball
bond lifting or neck breaks. If a moisture path between the
die-to-mold delamination and an external feature of the package exists,
then moisture and contaminants can reach the die surface from outside,
resulting in die corrosion or metal-to-metal leakage.
On the other
hand, a die paddle-to-mold delamination is a risk for package cracking,
as well as leadframe corrosion. Delamination between the molding
compound and lead fingers can exert tremendous shearing stresses on the
second bonds of the device, which can lead to heel breaks or wedge bond
Back to the FAQ Page...
All Rights Reserved.