Package-related Failure Mechanisms and Attributes

 

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Ball Lifting   

       

Ball lifting, is the detachment of a ball bond from the bond pad of a semiconductor device.

See separate article on ball lifting.

     

Bond Shorting

     

Bond Shorting is the presence of an unintended electrical connection between two bonds. 

See separate article on wirebond-related shorts.

   

Contamination, External   

  

External contamination is the presence of a foreign material, whether attached or unattached, anywhere on the external portions of the package and leads.

See separate article on external package contamination.

  

Contamination, Internal   

  

Internal contamination is the presence of a foreign material, whether attached or unattached, anywhere inside the package of the device.

See separate article on internal package contamination.

      

Cratering   

     

Cratering is a partial or total fracture of the silicon material underneath the bond pad.  Cratering is commonly due to excessive stresses on the bond pads from a poorly set up wirebonding machine.  Bonding time, force and power are critical parameters when dealing with cratering.

      

Die Chip-outs

  

Die chipping is a failure mechanism wherein a part or parts of the die break away from the die itself.

See separate article on die chipping.

     

Die Corrosion   

        

Die corrosion refers to the corrosion of the metal areas on the surface of the die.

See separate article on die corrosion.

       

Die Cracking

  

Die cracking is the occurrence of fracture(s) in or on any part of the die.

See separate article on die cracking.

      

Die Lifting

  

Die lifting is the disbonding or detachment of the die from its die pad or die cavity.

See separate article on die lifting.

      

Die Scratches   

    

Die scratch is the presence of abrasion, scraping, or laceration damage on the surface of the die.

See separate article on die scratching.

   

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See Also:  Die FailuresFailure AnalysisBasic FA Flows Reliability Models

    

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