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TSOP Singulation / Test / Tape & Reel
Due to a wide
variety of IC packages used in the semiconductor industry, there also
exist a large variety of manufacturing processes for IC packaging.
Semiconductor companies do their best to standardize their processes to
make their operations more efficient and less costly.
Unfortunately, making an assembly process for a particular package
efficient may sometimes mean having to come up with a process that's
different from those of other packages. The continuous struggle between
the regular emergence of new and different packages versus the
standardization of packaging processes has always posed a challenge to
semiconductor manufacturing engineers. The archived forum thread
below reflects this complex nature of semiconductor production
Mike_Balbuena: Fri Jun 23, 2006 10:48 pm
Post subject: TSOP singulation Process
In the assembly side at
singulation process does the singulation equipment
dispense units in tube? Or this is already an automated
equipment that incorporates singulation-final test and
Tape and Reel. I'm just confused since the standard
dictates units to be in tray or reel. Is there a pick
and place and moves units to the cavity trays instead of
operator manually loading the units in the tray?
Please help and clarify.
Posted by Jefriz: Thu
Jul 06, 2006 7:33 am Post
Singulated TSOP units usually uses trays. Final test
handlers are mostly not incorporated or in-line with
singulation equipment. Can you tell what standard you
are referring? Singulation machines using trays are
equipped with pick & place and usually incorporated with
Form. Some singulation machines are incorporated with
laser marker and mark (also lead) scanner. Its pick &
place mechanism is capable of sorting detected defects.
Let me know what is not clear.
Best regards, Jefriz
Mike_Balbuena: Thu Jul 06, 2006 8:48 am
Post subject: TSOP Singulation
I was referring to Jedec.
So do you mean most of the equipment has a pick and
place and can load it in tray a lot easier. Does other
equipment has tape and reel as well? Is it inconvenient
to request from manufacturers that units be in tray or
tape and reel?
I'm trying to determine if most of the industries has
tape and reel incorporated in their system. If not I
will just have our supplier shipped to us on tray.
Does other companies still used the traditional way of
loading on tubes during singulation?
Posted by Jefriz: Fri
Jul 07, 2006 10:40 am Post
For tray base singulation, all have pick & place while
tube base have the rail guide pusher (or similar
mechanism). The general concept is that manual
intervention is very limited. Your output is already in
tray or tube. Tape and reel can be done but I think you
would not select this since you still going to do
electrical testing. Selecting tray or tube would depend
on some factors, like what is your final test handler
set-up (tray or tube). And also cost of units on tray or
tube. If you are still going to buy a test handler or if
you are capable for both tray & tube, I think tube base
is more cheaper, more easier to handle and handler
mechanisms are very much simple although some package
related defects occur during the gravity feeding
movement of the units. If your TSOP have a thick body
size, tube is still suitable but for thinner body
(around 1 mm), tray base is much advisable. Convenience
to the manufacturer would depend on their capability. If
they can deliver on both tray and tube, you will just
consider your handler capability.
Tape and reel (T&R) units packing are usually done when
the next step is already SMT since pick and place
machines much prefer it. Most companies are adding the
capability of T&R because of more customer demand. Let
us face it, cost is a big factor and T&R is one of the
most (or the most) cheapest IC packing.
Some companies are still using tubes after singulation
because their test handler needs the units to be in
Regarding the JEDEC standard you mention, sorry if I
have not encountered such JEDEC standard that dictates
what specific packing method to use (can you give the
JESD/EIA number). In my opinion, JEDEC (industry)
Standard only recommends what to use. Which means that
most companies use these for several reasons like
convenience and cost effective but it would still depend
on each individual company’s capability and/or
direction. I don’t recommend that you generally stick
with the industry standards (like JEDEC) but only use
them as guide, if this suites your need then use it but
if it does not, then you might need to have an ”out of
the box” approach.
Best Regards, Jefriz
Mike_Balbuena: Fri Jul 07, 2006 8:08 pm
Post subject: Thanks
Thanks for the good answer....back in the days I used to
work in OSEP and I was one of the set-up engineers in
the Phil. You should be familiar with that company since
your in Taiwan.
Thanks so much but I'll keep in touch.
More power to SiliconFareast!!!!
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