|
SiliconFarEast.com Forum Archives
Failure
Analysis of Ball Shear Test Failures
Aside from
the Wire Pull Test, the
Ball Shear Test provides another measure of
how well the wirebonding process was
performed on an assembly lot. Lots exhibiting ball shear test
failures must be properly investigated to ensure that no lots are being
shipped with a wirebonding problem that can escalate into a field
reliability problem later on. The archived forum thread below
examines one such case. Fortunately, the thread starter was able to
resolve the issue and identify the root cause of the ball shear test
failures to be the dirty oven used for die
attach curing.
|
Posted by Tom Wang:
Fri Jul 07, 2006 12:55 pm
Post subject: ball shear failed |
|
|
|
Hi:
Recently, my company suffered from a trouble. Because of a
mass of ball shear low, a majority of of wb machine
down. We did EDS and cratering and intermetallics, but
no any abnormity was found. And we adjust the wb
parameter and wp/bs/ds parameter, again and again. But
the trouble is continued still. how difficult for us to
get the cause root!!
Any good suggestion, please let me know
thanks a lot
best regards
yours
farel |
|
| |
|
Posted by FARel Engr:
Fri Jul 07, 2006 2:26 pm
Post subject: |
|
|
|
Hi Tom,
How about your bond pull readings - are they low too?
Are all bonds affected - or just localized to certain
bonds? Anyway, here's a little suggestion: cross-section
bonds from several units. The objective is to look for
anomalies such as voids at the following: a) bond pad
metal layer; b) Al-Au intermetallic layer; and c) the
ball bond itself. You need to know where and how the
failure is occurring before you can correct it.
FARel Engr |
|
| |
|
Posted by Jefriz: Mon
Jul 10, 2006 12:31 pm Post
subject: Deteriorating BST |
|
|
|
Hello Tom,
Were there any changes in the materials, parameter
specs, environmental conditions or clamp/insert design?
Any changes on the method of doing BST? Do you have SPC
monitoring on your bonding temperature? Was the product
running already a long time (over 6 months) when the
deterioration happened? Have you also consider doing
FTIR on the fresh and prior bonding bond pads? Do this
on the bondpads after exposing to heat. Do you have
periodic cleaning of inserts (workholder) and spark
rods?
I am sorry if I cannot give you direct solution on the
problem but rather the areas where you can also
consider.
Best Regards, Jefriz |
|
| |
|
Posted by Tom Wang:
Mon Jul 10, 2006 2:26 pm
Post subject: |
|
|
|
On Jul.1'06, we found this issue,
but till now, no any one give a convincing answer.
trouble is just like a hill. No BST is changed. oh, No,
we have not SPC monotoring on bonding temp. we only do
ball shear/wire pull for w/b.
what is FTIR?
below is the bst data:
47.5 50.6 34.9 32.3 32.0 34.8 27.5 29.1 37.9 43.9
20.3 21.7 23.9 28.6 23.8 23.3 23.2 23.3 29.8 28.7
58.1 23.6 21.4 12.2 30.9 29.3 21.7 21.8 23.1 17.3
the LCL OF spc is 35
any good suggetion, please help me
rga
farel |
|
| |
|
|
Back to the 'Best of Forums' Archives
HOME
Copyright
©
2008
SiliconFarEast.com.
All Rights Reserved. |
|
|