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Plastic Package Chip-out
Figure 1. Plastic Package Chip-out
Figure 1 shows a SEM photo of a plastic package (SOIC) that has a chip-out on its pin 1 corner. This is a gross case of chip-out since an internal feature of the package, the pin 1 lead finger, has already been exposed. Chip-outs such as this are caused by the application of excessive mechanical stress on the package, usually during the post-mold assembly steps, i.e., deflash, trim, form, and singulation (DTFS).
See Also: Package Failures; Package Cracking
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