Semiconductor Industry Photo Gallery

 
 

Mechanically

Damaged Wire

Contamination on

Leadframe Die Pad

Bonding Wire

Corrosion

Bond Pad

Metal Lifting

       

Eutectic Balling

Contamination

on Leadframe

Contamination

on Die

Cratering

       

Ceramic Package

Chip-out

Plastic Package

Chip-out

Lifted Wedge Bond

Die Scratch

       
 

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