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Package
Marking Inks
As its
name implies, the ink marking process employed for printing brands and
other information on the package of a semiconductor device uses
ink.
Since semiconductor ink marking is usually done by
pad printing,
this ink is also referred to as pad printing ink.
Ink
chemistry developed for semiconductor use must enhance opacity and
marking contrast, shorten the drying or curing time, increase mark
permanence, and optimize manufacturability. Good opacity may be achieved
through a pigmentation system that provides the ink with a higher
concentration of pure pigments. An ink product should be able to
achieve the required opacity and contrast with only a single pass of pad
printing.
Ink
drying
or curing
may be achieved in different ways, e.g.,
air-drying,
heat-curing,
and uv curing.
Drying/curing requirements must be considered in the selection of the
appropriate ink for any semiconductor marking process.
A
properly cured ink must exhibit good permanence, or resistance to
chemical or mechanical damage.
Two major manufacturers of
pad printing ink for semiconductor package marking are Teca-Print and
Markem.
Table 1. Examples
of Markem Pad Printing Inks
Heat Cure Inks
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4482 Epoxy
based heat curing liquid ink for application by MARKEM pad
printers and similar pad printing systems onto substrates
including conventional and low stress molding compounds and
ceramics |
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4402 Epoxy
based ink for printing on glass, metal and phenolic |
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4403 Epoxy
based ink for printing on glass epoxy and ceramic |
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4405 Epoxy
based ink for printing on glass, epoxy and phenolic |
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4408R Single
part ink for printing on low stress and conventional molding
compounds |
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4461 Phenolic
based ink for printing on nickel, gold and epoxy |
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4481 Epoxy
based ink for printing on low stress molding compounds and acetal
plastics |
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4486 Urethane
based for printing on anodized aluminum, nickel, and gold. |
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4487 Single
part ink for printing on low stress molding compounds, ceramic,
anodized aluminium, nickel and gold. |
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4488 Single
part ink for printing on low stress molding compounds, nickel and
gold |
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4489 Single
part ink for printing on ceramic, aluminum and nickel |
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4496 Single
part urethane based pad printing ink for printing on low stress
molding compounds |
Two-Part Inks
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4407 Fast
drying ink for printing on low stress molding compounds, nylon and
aluminum |
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5462 Air
dry ink for printing on polyamide, acrylic and polycarbonate |
UV Cure Inks
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4460 Epoxy
based ink for printing on ceramic and plastic |
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4464 UV
cure ink for application by closed cup pad printing systems for
printing on low stress and conventional molding compounds |
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4465 UV
cure ink for printing on low stress molding compounds |
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4466 UV
cure ink for printing on electronic molding compounds |
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4495 UV
cure ink for printing on gold |
Disclaimer:
The information contained in this section were taken from various
publications and web sites of the featured manufacturers, and are intended for quick reference only. SFE shall
not be responsible for any effect, whether direct or indirect, that may
arise from the use of the above information. The readers are
encouraged to contact companies of their interest for more information
and a more complete listing of products available.
<Proceed to Page 2 -
Teca-Print Pad Printing Inks>
See Also:
Marking;
Semiconductor
Materials; IC
Manufacturing
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