Inks for Package Marking - Page 1 of 2: Markem Pad Printing Inks

Package Marking Inks

As its name implies, the ink marking process employed for printing brands and other information on the package of a semiconductor device uses ink. Since semiconductor ink marking is usually done by pad printing, this ink is also referred to as pad printing ink.

Ink chemistry developed for semiconductor use must enhance opacity and marking contrast, shorten the drying or curing time, increase mark permanence, and optimize manufacturability. Good opacity may be achieved through a pigmentation system that provides the ink with a higher concentration of pure pigments. An ink product should be able to achieve the required opacity and contrast with only a single pass of pad printing.

Ink drying or curing may be achieved in different ways, e.g., air-drying, heat-curing, and uv curing. Drying/curing requirements must be considered in the selection of the appropriate ink for any semiconductor marking process.

A properly cured ink must exhibit good permanence, or resistance to chemical or mechanical damage.

Two major manufacturers of pad printing ink for semiconductor package marking are Teca-Print and Markem.

Table 1. Examples of Markem Pad Printing Inks

Heat Cure Inks

4482 Epoxy based heat curing liquid ink for application by MARKEM pad printers and similar pad printing systems onto substrates including conventional and low stress molding compounds and ceramics

4402 Epoxy based ink for printing on glass, metal and phenolic

4403 Epoxy based ink for printing on glass epoxy and ceramic

4405 Epoxy based ink for printing on glass, epoxy and phenolic

4408R Single part ink for printing on low stress and conventional molding compounds

4461 Phenolic based ink for printing on nickel, gold and epoxy

4481 Epoxy based ink for printing on low stress molding compounds and acetal plastics

4486 Urethane based for printing on anodized aluminum, nickel, and gold.

4487 Single part ink for printing on low stress molding compounds, ceramic, anodized aluminium, nickel and gold.

4488 Single part ink for printing on low stress molding compounds, nickel and gold

4489 Single part ink for printing on ceramic, aluminum and nickel

4496 Single part urethane based pad printing ink for printing on low stress molding compounds

Two-Part Inks

4407 Fast drying ink for printing on low stress molding compounds, nylon and aluminum

5462 Air dry ink for printing on polyamide, acrylic and polycarbonate

UV Cure Inks

4460 Epoxy based ink for printing on ceramic and plastic

4464 UV cure ink for application by closed cup pad printing systems for printing on low stress and conventional molding compounds

4465 UV cure ink for printing on low stress molding compounds

4466 UV cure ink for printing on electronic molding compounds

4495 UV cure ink for printing on gold

Disclaimer: The information contained in this section were taken from various publications and web sites of the featured manufacturers, and are intended for quick reference only. SFE shall not be responsible for any effect, whether direct or indirect, that may arise from the use of the above information. The readers are encouraged to contact companies of their interest for more information and a more complete listing of products available.

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