JEDEC Standards: J-STD-020; J-STD-033; J-STD-035; J-STD-002

SELECTED JEDEC STANDARDS

For a more complete list of standards, pls see http:www.jedec.org

J-STD-020

JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SOLID STATE SURFACE-MOUNT DEVICES

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress. It is used to determine what classification level should be used for initial reliability qualification. Once identified, the SMDs can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation. This revision now covers components to be processed at higher temperatures for lead-free assembly.

J-STD-033

JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES

This document provides SMD manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs. Now updated to support components that may need to be processed at higher temperatures, such as lead-free processes, these methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. IPC/JEDEC J-STD-033A helps achieve safe and damage-free reflow with the dry packing process and provides a minimum shelf life of 12 months from the seal date when using sealed dry bags.

J-STD-035

JOINT IPC/JEDEC STANDARD FOR ACOUSTIC MICROSCOPY FOR NONHERMETRIC ENCAPSULATED ELECTRONIC COMPONENTS

This standard defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. This method provides users with an acoustic microscopy process reflow for detecting defects non-destructively in plastic packages while achieving reproducibility.

J-STD-002

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

This document defines a standard test method for evaluating the solderability of the leads or interconnect features of components, as well as lugs, terminals, wires, and other forms of terminations. Solderability is defined as the ability of the termination to form a uniform, smooth, unbroken, film of solder on its surface with excellent adhesion properties.

MORE LINKS to JEDEC SPECS:

Solderability Testing

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