SELECTED JEDEC STANDARDS

For a more complete list of standards, pls see http:www.jedec.org

     

 

     

 

JESD22-A100  -  CYCLED TEMPERATURE HUMIDITY BIAS LIFE TEST

    

This document pertains to the Cycled Temperature-Humidity-Bias Life Test, which is performed to evaluate the reliability of non-hermetically packaged solid state devices in humid environments. It employs conditions of temperature cycling, humidity, and bias that accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors that pass through it.

      

JESD22-A101  -  STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST

     

This standard establishes a defined method for performing a temperature humidity life test with bias applied. The test is used to evaluate the reliability of non-hermetically packaged solid state devices in humid environments. It employs high temperature and humidity conditions to accelerate the penetration of moisture through external protective material or along interfaces between the external protective coating and conductors or other features which pass through it.

    

JESD22-A102  -  ACCELERATED MOISTURE RESISTANCE - UNBIASED AUTOCLAVE

    

This standard pertains to the Unbiased Autoclave Test, which is performed to evaluate the moisture resistance of non-hermetically packaged solid state devices. It is a highly accelerated test which employs conditions of pressure, humidity and temperature under condensing conditions to accelerate moisture penetration through the external protective material (encapsulant or seal) of the package or along the interface between the external protective material and the metallic conductors passing through it.

     

JESD22-A104  -  TEMPERATURE CYCLING

     

This standard provides a method for determining solid state devices' capability to withstand exposure to alternating cycles of extremely high and extremely low temperatures. The worst-case load temperature must reach the specific extremes to ensure proper sample stressing regardless of chamber loading. Definitions are provided for Load, Monitoring Sensor, Worst-Case Load Temperature, and Working Zone.

      

JESD22-A105  -  POWER AND TEMPERATURE CYCLING

     

This document establishes  a method for determining the ability of a device to withstand exposure to alternating cycles of extremely high and extremely low temperatures, with operating biases periodically applied and removed. This test method is considered destructive, and is intended primarily for device qualification.  

      

JESD22-A106  -  THERMAL SHOCK

     

This document defines the requirements of Thermal Shock testing, which is conducted to determine the resistance of a part to exposure to sudden and extreme changes in temperature, as well as its resistance to the alternating exposures to  extremely high and low temperatures.  

                 

                 

MORE LINKS to JEDEC SPECS:

<Packaging: Handling/Using Moisture Sensitive Devices, etc.>

<Reliability Testing: Precon, HAST, Salt Atmosphere, Operating Life, ESD>

<Package Testing: Visual, Solderability, Mechanical, Lead Integrity>

<Package Testing: RTSH, Coplanarity, Flip Chip Pull, WB/Solder Ball Shear>

 

 

      

See Also:  Reliability Engineering;  MIL-STD-883 Methods;  IPC/JEDEC MSL's

   

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