SELECTED
JEDEC STANDARDS
For
a more complete list of standards, pls see http:www.jedec.org
JESD22-A107
- SALT
ATMOSPHERE
This standard
defines a method for
determining the resistance of solid state devices against corrosion as a result
of exposure to a saline atmosphere.
JESD22-A108
-
TEMPERATURE, BIAS, AND OPERATING
LIFE
This standard
defines a method for determining the
effects of bias conditions and temperature on the operating life of solid
state devices.
JESD22-A110
- HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST)
This document
defines a standard method for performing HAST, which
evaluates the reliability of non-hermetically packaged solid state
devices exposed to humid environments, particularly their resistance to
internal corrosion. It employs severe conditions of temperature, humidity,
and bias that accelerate the penetration of moisture into the package and
die.
JESD22-A113
- PRECONDITIONING
OF PLASTIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
This document
establishes an industry-standard preconditioning procedure for plastic SMDs (surface mount devices),
which is intended to simulate a typical board-mounting process with multiple reflow operations. Plastic SMDs
should be subjected to the appropriate preconditioning sequence of this
document by the semiconductor manufacturer prior to being submitted to
specific in-house reliability testing (qualification and reliability
monitoring) to evaluate long term reliability.
JESD22-A114
- ELECTROSTATIC
DISCHARGE (ESD) SENSITIVITY TESTING HUMAN BODY MODEL (HBM)
This document
defines a standard method for testing and classifying microcircuits
according to their susceptibility to damage or degradation by exposure to Human Body Model (HBM) electrostatic discharge
(ESD). The objective is to provide reliable, repeatable HBM ESD test
results so that accurate classifications can be performed.
JESD22-A115
- ELECTROSTATIC
DISCHARGE (ESD) SENSITIVITY TESTING MACHINE MODEL (MM)
This document defines
a standard method for testing and classifying microcircuits
according to their susceptibility to damage or degradation by exposure to
Machine Model (MM) electrostatic discharge (ESD). The objective
is to provide reliable, repeatable MM ESD test results so that accurate
classifications can be performed.
JESD22-C101 -
FIELD-INDUCED
CHARGED-DEVICE MODEL TEST METHOD FOR ELECTROSTATIC DISCHARGE WITHSTAND
THRESHOLDS OF MICROELECTRONIC COMPONENTS
This
document defines
a standard method for
testing and
classifying microcircuits according to their susceptibility to damage or
degradation by exposure to Charged Device Model (CDM) electrostatic
discharge (ESD). The charged device
model simulates device charging/discharging events that occur in
production equipment and processes.
MORE
LINKS to JEDEC SPECS:
<Packaging: Handling/Using Moisture Sensitive Devices,
etc.>
<Reliability Testing: THB, Autoclave, Temp Cycle, Thermal
Shock>
<Package Testing: Visual, Solderability,
Mechanical, Lead Integrity>
<Package Testing: RTSH, Coplanarity, Flip Chip
Pull, WB/Solder Ball Shear>
See Also:
Reliability
Engineering; MIL-STD-883 Methods; IPC/JEDEC MSL's;
ESD Standards
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