SELECTED JEDEC STANDARDS

For a more complete list of standards, pls see http:www.jedec.org

     

 

     

 

JESD22-A107  -  SALT ATMOSPHERE

      

This standard defines a method for determining the resistance of solid state devices against corrosion as a result of exposure to a saline atmosphere.

     

JESD22-A108  -  TEMPERATURE, BIAS, AND OPERATING LIFE

     

This standard defines a method for determining the effects of bias conditions and temperature on the operating life of solid state devices.

      

JESD22-A110  -  HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST)

     

This document defines a standard method for performing HAST, which evaluates the reliability of non-hermetically packaged solid state devices exposed to humid environments, particularly their resistance to internal corrosion. It employs severe conditions of temperature, humidity, and bias that accelerate the penetration of moisture into the package and  die.  

       

JESD22-A113  -  PRECONDITIONING OF PLASTIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING

     

This document establishes an industry-standard preconditioning procedure for plastic SMDs (surface mount devices), which is intended to simulate a typical board-mounting process with multiple reflow operations. Plastic SMDs should be subjected to the appropriate preconditioning sequence of this document by the semiconductor manufacturer prior to being submitted to specific in-house reliability testing (qualification and reliability monitoring) to evaluate long term reliability.  

      

JESD22-A114  -  ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING HUMAN BODY MODEL (HBM)

 

This document defines a standard method for testing and classifying microcircuits according to their susceptibility to damage or degradation by exposure to  Human Body Model (HBM) electrostatic discharge (ESD). The objective is to provide reliable, repeatable HBM ESD test results so that accurate classifications can be performed.  

      

JESD22-A115 - ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING MACHINE MODEL (MM)

     

This document defines a standard method for testing and classifying microcircuits according to their susceptibility to damage or degradation by exposure to Machine Model (MM) electrostatic discharge (ESD). The objective is to provide reliable, repeatable MM ESD test results so that accurate classifications can be performed.  

      

JESD22-C101  -  FIELD-INDUCED CHARGED-DEVICE MODEL TEST METHOD FOR ELECTROSTATIC DISCHARGE WITHSTAND THRESHOLDS OF MICROELECTRONIC COMPONENTS

      

This document defines a standard method for testing and classifying microcircuits according to their susceptibility to damage or degradation by exposure to Charged Device Model (CDM) electrostatic discharge (ESD). The charged device model simulates device charging/discharging events that occur in production equipment and processes.  

                 

                 

MORE LINKS to JEDEC SPECS:

<Packaging: Handling/Using Moisture Sensitive Devices, etc.>

<Reliability Testing: THB, Autoclave, Temp Cycle, Thermal Shock>

<Package Testing: Visual, Solderability, Mechanical, Lead Integrity>

<Package Testing: RTSH, Coplanarity, Flip Chip Pull, WB/Solder Ball Shear>

 

 

      

See Also:  Reliability Engineering;  MIL-STD-883 Methods;  IPC/JEDEC MSL's ESD Standards

   

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