JEDEC Standards: JESD22-B100; JESD22-B101; JESD22-B102; JESD22-B103; JESD22-B104; JESD22-B105

Custom Search

SELECTED JEDEC STANDARDS

For a more complete list of standards, pls see http:www.jedec.org

JESD22-B100 - PHYSICAL DIMENSION TESTS

The standard provides a method for determining whether the external physical dimensions of the device are in accordance with the applicable procurement document.

JESD22-B101 - EXTERNAL VISUAL INSPECTION

This document pertains to external visual inspection, the purpose of which is to verify that the materials, design, construction, markings, and workmanship of the device are in accordance with the applicable procurement document. External visual is a nondestructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.

JESD22-B102 - SOLDERABILITY TESTING

This document defines a standard test method for determining the solderability of device package terminations that are intended to be joined to another surface using solder for the attachment. It also provides optional conditions for aging and soldering for the purpose of allowing simulation of the soldering process to be used in the device applications. It provides procedures for dip and look solderability testing of through hole, axial and surface mount devices and simulated reflow testing for surface mount packages.

JESD22-B103 - VIBRATION, VARIABLE FREQUENCY TESTING

This standard pertains to the Vibration, Variable Frequency Test Method, which is intended to determine the ability of component(s) to withstand moderate to severe vibration as a result of motion produced by transportation or filed operation of electrical equipment. This is a destructive test that is intended for component qualification.

JESD22-B104 - MECHANICAL SHOCK TEST

This document defines a standard test for determining the suitability of component parts for use in electronic equipment that may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. This is a destructive test intended for device qualification, and is normally applicable to cavity-type packages.

JESD22-B105 - LEAD INTEGRITY TEST

This standard provides various tests for determining the integrity of lead/package interfaces and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for reassembly. For hermetic packages it is recommended that this test be followed by hermeticity tests in accordance with Test Method A109 to determine if there are any adverse effects from the stresses applied to the seals as well as to the leads. This test, including each of its test conditions, is considered destructive and is only recommended for qualification testing. This test is applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

MORE LINKS to JEDEC SPECS:

<Packaging: Handling/Using Moisture Sensitive Devices, etc.>

Solderability Testing

HOME