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SELECTED JEDEC STANDARDS For a more complete list of standards, pls see http:www.jedec.org
JESD22-B106
RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
This document establishes a standard procedure for determining whether through-hole solid state devices can withstand the effects of the high temperature to which they will be subjected during the soldering of their leads.
JESD22-B107
COPLANARITY TEST FOR SURFACE-MOUNT SEMICONDUCTOR DEVICES
This document defines a standard test for measuring the deviation of the terminals (leads or solder balls) of surface-mount semiconductor devices from perfect coplanarity.
JESD22-B109
FLIP CHIP TENSILE PULL TEST
This document pertains to the Flip Chip Tensile Pull Test Method, which is performed to determine the fracture mode and strength of the solder bump interconnection between the flip chip die and the substrate. It should be used to assess the quality and consistency of the chip-substrate joining process. This test method is a destructive test.
JESD22-B116
WIRE BOND SHEAR TEST
This document establishes a standard procedure for determining the strength of an integrated circuit's wire bond by shearing the bond from the surface it is attached to and measuring the force required to accomplish it. This method serves as an alternative to pulling the wire vertically until the wire separates from one of it's two bonded surfaces. It also provides guidelines for determining an appropriate minimum shear force for gold balls on aluminum alloy bonding surfaces.
JESD22-B117
BALL GRID ARRAY (BGA) BALL SHEAR
This document defines a standard BGA Ball Shear Test method. It defines the terms related to ball shear testing; describes the BGA ball shear test apparatus and procedure; and identifies the BGA ball shear failure modes and their criteria.
MORE LINKS to JEDEC SPECS: <Packaging: Handling/Using Moisture Sensitive Devices, etc.> <Reliability Testing: THB, Autoclave, Temp Cycle, Thermal Shock> <Reliability Testing: Precon, HAST, Salt Atmosphere, Operating Life, ESD> <Package Testing: Visual, Solderability, Mechanical, Lead Integrity>
See Also: Reliability Engineering; MIL-STD-883 Methods; IPC/JEDEC MSL's; Solderability Testing; Bond Strength Tests
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