SELECTED
JEDEC STANDARDS
For
a more complete list of standards, pls see
http:www.jedec.org
JESD22-B106
RESISTANCE TO
SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
This document
establishes a standard procedure for determining whether through-hole
solid state devices can withstand the effects of the high temperature to which
they will be subjected during the soldering of their leads.
JESD22-B107
COPLANARITY
TEST FOR SURFACE-MOUNT SEMICONDUCTOR DEVICES
This document
defines a standard test for measuring the deviation of the terminals
(leads or solder balls) of surface-mount semiconductor devices from perfect coplanarity.
JESD22-B109
FLIP CHIP
TENSILE PULL TEST
This document
pertains to the Flip Chip
Tensile Pull Test Method, which is performed to determine the fracture mode and
strength of the solder bump interconnection between the flip chip die and
the substrate. It should be used to assess the quality and consistency of the chip-substrate
joining process. This test method is a destructive test.
JESD22-B116
WIRE BOND SHEAR
TEST
This document establishes a standard procedure for determining the strength of an
integrated circuit's wire bond by shearing the bond from the surface it is
attached to and measuring the force required to accomplish it. This method serves as an
alternative to pulling the wire vertically until the wire separates from
one of it's two bonded surfaces. It also provides guidelines for
determining an appropriate minimum shear force for gold balls on aluminum
alloy bonding surfaces.
JESD22-B117
BALL GRID ARRAY
(BGA) BALL SHEAR
This document
defines a standard BGA Ball Shear Test method. It defines the terms
related to ball shear testing;
describes the BGA ball shear test apparatus and procedure; and identifies
the BGA ball shear failure modes and their criteria.
MORE
LINKS to JEDEC SPECS:
<Packaging: Handling/Using Moisture Sensitive Devices,
etc.>
<Reliability Testing: THB, Autoclave, Temp Cycle, Thermal
Shock>
<Reliability Testing: Precon, HAST, Salt
Atmosphere, Operating Life, ESD>
<Package Testing: Visual, Solderability,
Mechanical, Lead Integrity>
See Also:
Reliability
Engineering; MIL-STD-883 Methods; IPC/JEDEC MSL's;
Solderability Testing; Bond
Strength Tests
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