Lead Finish Guides - Page 1 of 2: Tin Plating Troubleshooting

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Lead Finish Troubleshooting Guides

Tin plating and solder plating are two common lead finish processes used in semiconductor manufacturing. The following tables serve as quick references for troubleshooting problems related to these processes. Table 1 is a troubleshooting guide for tin plating processes, while Table 2 is intended to help with solder plating processes.

Table 1. Troubleshooting Guide for Tin Plating

Problem	Cause(s)	Remedy
Formation of Dendrites	Insufficient amount of brightener/ additives/replenishment chemicals	Add more brightener/ additives/replenishment chemicals
Formation of Dendrites	Insufficient amount of acid	Add more acid (usually sulfuric acid)
Formation of Nodules	Presence of solids in bath	Filter the bath
Graininess	Insufficient replenishment of additive chemicals	Add more replenishment chemicals
Graininess	Insufficient amount of metal	Add stannous sulfate
Burning	High plating current	Decrease the plating current
Blistering	Inadequate or poor cleaning	Perform proper cleaning
Pitting	Insufficient replenishment of additive chemicals	Add more replenishment chemicals
Reduced Throwing Power	Insufficient replenishment of additive chemicals	Add more replenishment chemicals
	Insufficient amount of acid	Add more acid (usually sulfuric acid)
	Insufficient amount of metal	Add stannous sulfate
Gassing	High plating current	Decrease the plating current
Gassing	High plating voltage	Decrease the plating voltage
Anode Polarization	High plating current	Decrease the plating current; add anode
Formation of Brittle Deposits	Organic contamination	Conduct carbon treatment

See also: Lead Finish; Pb-free Manufacturing

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