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Lead Finish Troubleshooting Guides
Tin plating and solder plating are two common lead finish processes used in semiconductor manufacturing. The following tables serve as quick references for troubleshooting problems related to these processes. Table 1 is a troubleshooting guide for tin plating processes, while Table 2 is intended to help with solder plating processes.
Table 1.
Troubleshooting Guide for
Tin Plating
Problem
Cause(s)
Remedy
Formation of Dendrites
Insufficient amount of brightener/ additives/replenishment
chemicals
Add more
brightener/ additives/replenishment chemicals
Insufficient amount of acid
Add
more acid (usually sulfuric acid)
Formation of Nodules
Presence
of solids in bath
Filter
the bath
Graininess
Insufficient replenishment of additive chemicals
Add more
replenishment chemicals
Insufficient amount of metal
Add
stannous sulfate
Burning
High
plating current
Decrease
the plating current
Blistering
Inadequate or poor cleaning
Perform proper
cleaning
Pitting
Insufficient replenishment of additive chemicals
Add more
replenishment chemicals
Reduced
Throwing Power
Insufficient replenishment of additive chemicals
Add more
replenishment chemicals
Insufficient amount of acid
Add
more acid (usually sulfuric acid)
Insufficient amount of metal
Add
stannous sulfate
Gassing
High
plating current
Decrease
the plating current
High
plating voltage
Decrease
the plating voltage
Anode
Polarization
High
plating current
Decrease
the plating current; add anode
Formation of Brittle Deposits
Organic contamination
Conduct
carbon treatment
<Proceed to Table 2 - Solder Plating
Troubleshooting Guide>
See
also:
Lead Finish; Pb-free
Manufacturing
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