The
Low-Profile Fine Pitch Ball
Grid Array,
or LFPBGA,
is
a smaller version of the
ball grid array (BGA)
package. It is basically an FBGA package that has
a package height ranging from 1.2 mm and 1.7 mm.
It is therefore thicker than the TFBGA and the
VFBGA.
Typical LFBGA's have ball counts that range
from 48 to 865 solder balls. The typical LFBGA ball pitch is
0.50 mm to 0.8 mm. A typical
LFBGA is about 1.3 mm
to 1.7 mm thick.
Table 1.
Properties of Some LFBGA's
|
No. of
Balls |
Body
Size |
Package Height
(incl.
solder balls) |
Ball Pitch |
|
96 |
5.5 mm x
13.5
mm |
1.4 mm |
0.8 mm |
|
100 |
10 mm x 10
mm |
1.6 mm |
0.8 mm |
|
144 |
10 mm x 10
mm |
1.4 mm |
0.8 mm |
|
225 |
13 mm x 13
mm |
1.5 mm |
0.8 mm |
|
240 |
13 mm x 13
mm |
1.7 mm |
0.65 mm |
|
289 |
15 mm x 15
mm |
1.4 mm |
0.8 mm |
|
357 |
20 mm x 20
mm |
1.5 mm |
0.8 mm |
|
529 |
14 mm x 14
mm |
1.35 mm |
0.5 mm |
|
865 |
17 mm x 17
mm |
1.4 mm |
0.5 mm |
