Shock Test - Mil-Std-883 Method 2002
is a test performed to determine the ability of
semiconductor devices to withstand moderately severe shocks resulting
from suddenly applied forces or abrupt changes in motion encountered
during mishandling, improper transportation, or field operation. Shocks
of this type can cause devices to
degrade in performance, or
to even get damaged permanently. Shock pulses that are repetitive
can also cause damage that is similar to those caused by extreme
Mil-Std-883 Method 2002
is the most widely-used industry standard for
performing this test.
Mechanical shock testing
requires an apparatus that is capable of providing
of 500 to 30,000 g
(peak), with the
pulse width or duration ranging from
0.1 to 1 millisecond,
to the body of the device package. The acceleration pulse shall be
a half sine wave with a distortion not exceeding +/-20% of the specified
peak acceleration. It shall be measured by a transducer and optional
electronic filter whose cut-off frequency is at least 5 times the
fundamental frequency of the shock pulse. The pulse width shall be
measured between the 10% point of the peak acceleration during rise time
and the 10% point during decay time. The pulse width shall have a
tolerance of whichever is greater between +/-0.1 millisecond or +/-30%
of the specified width.
The mechanical shock
testing machine must be mounted on a sturdy and leveled surface.
During testing, the device must be rigidly mounted or restrained by its
case or body, with ample protection for the leads. Unless otherwise
specified, the samples shall be subjected to
5 shock pulses,
with the peak intensity and duration of the pulses complying with those
defined by the specified
in each of the following
X1, X2, Y2, Y1, Z1, Z2. For devices with internal
elements mounted with the major seating plane perpendicular to the Y
axis, the Y1 orientation is defined as the one that tends to displace
the elements from their mount. Unless otherwise stated, the test
condition to be applied is Test Condition B.
Table 1 shows the various
test conditions for mechanical shock testing as defined by
Mil-Std-883 Method 2002.
Test condition B
shall apply, unless otherwise stated.
Table 1. Test Conditions for
Mechanical Shock Testing
per Mil-Std-883 Method 2002
Pulse Duration (ms)
After the mechanical shock test has been completed,
of the case, leads, and seals shall be performed at 10 X to 20 X. The
marking shall also be inspected with or without magnification, but with
the magnification no greater than 3 X. An illegible mark and/or any
evidence of damage to the case, leads, or seals after the stress test
shall be considered a
Additional specified measurements may also be done after this test.
following shall be indicated in the
1) test condition applied if other than test condition B; 2) number and
direction of pulses if other than specified; 3) electrical load
conditions (if any); 4) measurements made after the stress test; and 5)
measurements during test, if required.
Mil-Std-883 Method 2002
Test or PCT; Temperature
Heat Resistance Test (SHRT);
Package Failures; Die
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