|
Wafer Fab |
-
fabrication process sequence or process limits
-
fabrication process materials or material specs
-
photoresist materials or material specs
- doping
material source, concentration, or process technique
-
cross-section diffusion profile
-
passivation or glassivation material, thickness, or technique
-
metallization system (pattern, material, deposition/etch
technique, line width/thickness)
-
bond pad geometry, spacing or metallization
-
baseline
-
conductor, resistor, or dielectric materials
- wafer
fab move from one line or building to another
|
-
passivation or glassivation process-
oxidation or diffusion process, oxide composition and thickness,
oxidation temperature and time
-
sintering or annealing temperature and time
- SEC
and how it is tested
- method
of mask making
-
parametric monitor and method of test
- wafer
acceptance criteria
- TCV
and how it is tested
-
sampling plans
- gate
formation process, material, technique
-
backside process including wafer thinning and backside
metallization
- ohmic
contact formation
-
starting material qualification
- lot
formation |
|
Assembly |
- die
attach material, method, or location
-
wire/ribbon bond interconnection method
- wire
material, composition, and dimensions
- seal
technique (materials, process, etc.)
-
internal visual inspection and other test procedures
-
assembly flow
-
assembly operation move |
-
scribing and die separation method
- TCI
procedures including manufacturer imposed tests
-
screening tests
-
sampling plans
- die
back surface preparation
-
molding material, method, or location
- chip
coating material and technique
- device
marking process
- lot
formation |
|
Package |
- vendor
-
external dimensions
- cavity
dimensions
- number
of leads or terminals
- lead
or terminal dimensions
- lead
or terminal base material
- lead
or terminal plating material
- lead
or terminal plating thickness
-
package body material
-
package body plating material
-
package body plating thickness
- die
pad material
- die
pad plating
- die
pad plating thickness |
- lid
material
- lid
plating material
- lid
plating thickness
- lid
seal (preform) material
- lid
glass seal material
- lead
glass seal material
- lead
glass seal diameter
- leads
or terminal spacing
- lead
configuration (e.g., J-lead, gullwing, etc.)
- die
size
- device
marking
- lead
attachment |
