Mil-Std-883 Method 5005 Group A and Group C Tests

Mil-Std-883 Method 5005 Quality Conformance Inspection

(QCI) Group Tests - Page 1 of 3: Group A and Group C Tests

The following group tests are used for qualifications or quality conformance inspections of semiconductor products used for military purposes.

Table 1. Mil-Std-883 Method 5005 Group A Electrical Tests

(for Class-S and Class-B Devices)

Subgroup	Examination/Test	SS	Accept #	Conditions
Subgroup 1	Static Tests	116	0 reject	T_amb= 25 deg C
Subgroup 2	Static Tests	116	0 reject	T_amb = T_max
Subgroup 3	Static Tests	116	0 reject	T_amb = T_min
Subgroup 4	Dynamic Tests	116	0 reject	T_amb= 25 deg C
Subgroup 5	Dynamic Tests	116	0 reject	T_amb = T_max
Subgroup 6	Dynamic Tests	116	0 reject	T_amb = T_min
Subgroup 7	Functional Tests	116	0 reject	T_amb= 25 deg C
Subgroup 8	Functional Tests	116	0 reject	T_amb = T_max
Subgroup 8b	Functional Tests	116	0 reject	T_amb = T_min
Subgroup 9	Switching Tests	116	0 reject	T_amb= 25 deg C
Subgroup 10	Switching Tests	116	0 reject	T_amb = T_max
Subgroup 11	Switching Tests	116	0 reject	T_amb = T_min

Table 2. Mil-Std-883 Method 5005 Group C (Die-Related) Tests

(for Class-B Devices Only)

Subgroup

Tests /Conditions

Accept #

Subgroup 1

a. Steady-state Life Test - Mil-Std-883 Method 1005

- use bias conditions per device specifications;

- 1000 hours at 125 deg C or equivalent per Table I of Method 1005

0 reject

b. End-point electrical parameters

- Per the applicable device specifications

0 reject

Disclaimer: The original document from which the information on this web page were taken, Mil-Std-883 Method 5005, contains many notes that do not appear on this page. Thus, people are advised to use this web page in conjunction with the original document.

Reliability Engineering; Reliability Tests

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