Mil-Std-883 Method 5005 Quality Conformance Inspection

(QCI) Group Tests: Group A and Group C Tests

     

The following group tests are used for qualifications or quality conformance inspections of semiconductor products used for military purposes.       

             

Table 1.  Mil-Std-883 Method 5005 Group A Electrical Tests

(for Class-S and Class-B Devices)

Subgroup

Examination/Test

SS 

Accept #

Conditions

Subgroup 1

Static Tests

116

0 reject

Tamb = 25 deg C

Subgroup 2

Static Tests

116

0 reject

Tamb = Tmax

Subgroup 3

Static Tests

116

0 reject

Tamb = Tmin

Subgroup 4

Dynamic Tests

116

0 reject

Tamb = 25 deg C

Subgroup 5

Dynamic Tests

116

0 reject

Tamb = Tmax

Subgroup 6

Dynamic Tests

116

0 reject

Tamb = Tmin

Subgroup 7

Functional Tests

116

0 reject

Tamb = 25 deg C

Subgroup 8

Functional Tests

116

0 reject

Tamb = Tmax

Subgroup 8b

Functional Tests

116

0 reject

Tamb = Tmin

Subgroup 9

Switching Tests

116

0 reject

Tamb = 25 deg C

Subgroup 10

Switching Tests

116

0 reject

Tamb = Tmax

Subgroup 11

Switching Tests

116

0 reject

Tamb = Tmin

      

     

Table 2.  Mil-Std-883 Method 5005 Group C (Die-Related) Tests

(for Class-B Devices Only)

Subgroup

Tests /Conditions

SS 

Accept #

   

Subgroup 1

    

      

 

       

a.  Steady-state Life Test - Mil-Std-883 Method 1005

- use bias conditions per device specifications;

- 1000 hours at 125 deg C or equivalent per Table I of Method 1005

45

0 reject

b. End-point electrical parameters         

Per the applicable device specifications

45

0 reject

          

Table 3.  Mil-Std-883 Method 5005 Group B Tests

(for Class-S and Class-B Devices)

Subgroup

Tests /Conditions

SS 

Accept #

        

Subgroup 1

(not required for Class B)    

a.  Physical Dimensions - Mil-Std-883 Method 2016

2

0 reject

b.  Internal Water Vapor Content - Mil-Std-883 Method 1018

3 (or 5)

0 reject for SS=3;

1 reject for SS=5

        

Subgroup 2

   

a.  Resistance to Solvents - Mil-Std-883 Method 2015

3

0 reject

b.  Internal Visual Inspection - Mil-Std-883 Method 2010 (not required for Class B)

2

0 reject

c.  Bond Strength Test - Mil-Std-883 Method 2011

1) Thermocompression - Cond. C or D

2) Ultrasonic or Wedge - Cond. C or D

3) Flip-chip - Cond. F

4) Beam Lead - Cond. H

Class S -22 wires;

Class B -15 wires

0 reject

d.  Die Shear / Substrate Attach Test - Mil-Std-883 Method 2019 or 2027 (not required for Class B)

3

0 reject

        

Subgroup 3

   

a.  Solderability Test - Mil-Std-883 Method 2003

- soldering temperature of 245 C +/-5 C

22 leads

0 reject

        

Subgroup 4

(not required for Class B)

     

a.  Lead Integrity - Mil-Std-883 Method 2004

      - test condition B2 (Lead Fatigue)

45

0 reject

b. Seal Integrity - Mil-Std-883 Method 1014

1)  Fine Leak Test

2) Gross Leak Test

15

0 reject

c.  Lid Torque Test - Mil-Std-883 Method 2024

5

0 reject

        

Subgroup 5

(not required for Class B)

     

a.  End-point electrical parameters

- Per the applicable device specifications

45

0 reject

a.  Steady-state Life Test - Mil-Std-883 Method 1005 

- use bias conditions per device specifications;      

- 1000 hours at 125 deg C or equivalent per Table I of Method 1005

45

 

0 reject

 

c.  End-point electrical parameters

- Per the applicable device specifications

45

0 reject

        

Subgroup 6

(not required for Class B)

     

a.  End-point electrical parameters

- Per the applicable device specifications

15

0 reject

b. Temperature Cycle - Mil-Std-883 Method 1010

- test condition C, 100X min.

15

0 reject

c.  Constant Acceleration - Mil-Std-883 Method

2001- test condition E min.

15

0 reject

d. Seal Integrity - Mil-Std-883 Method 1014

1)  Fine Leak Test

2) Gross Leak Test

15

0 reject

e.  End-point electrical parameters

- Per the applicable device specifications

15

0 reject

          

Table 4.  Mil-Std-883 Method 5005 Group D (Package-Related) Tests

(for all Classes of devices )

Subgroup

Tests /Conditions

SS 

Accept #

Subgroup 1

a.  Physical Dimensions - Mil-Std-883 Method 2016

15

0 reject

Subgroup 2

a.  Lead Integrity - Mil-Std-883 Method 2004

      - test condition B2 (Lead Fatigue)

45

0 reject

b.  Seal Integrity - Mil-Std-883 Method 1014

1)  Fine Leak Test

2) Gross Leak Test

45

0 reject

Subgroup 3

a.  Thermal Shock - Mil-Std-883 Method 1011

- test condition B min.; 15X min.

15

0 reject

b. Temperature Cycle - Mil-Std-883 Method 1010

- test condition C, 100X min.

15

0 reject

c.  Moisture Resistance - Mil-Std-883 Method 1004

15

0 reject

d. Visual Inspection - per criteria in Mil-Std-883 Methods 1004 and 1010

15

0 reject

e.  Seal Integrity - Mil-Std-883 Method 1014

1)  Fine Leak Test

2) Gross Leak Test

15

0 reject

f.  End-point electrical parameters

- Per the applicable device specifications

15

0 reject

Subgroup 4

a.  Mechanical Shock - Mil-Std-883 Method 2002

- test condition B min.

15

0 reject

b. Vibration Test, Variable Frequency - Mil-Std-883 Method 2007

- test condition A min.

15

0 reject

c.  Constant Acceleration - Mil-Std-883 Method

2001

- test condition E min.

15

0 reject

d. Seal Integrity - Mil-Std-883 Method 1014

1)  Fine Leak Test

2) Gross Leak Test

15

0 reject

e. Visual Inspection - per criteria in Mil-Std-883 Methods 1010 or 1011

15

0 reject

f.  End-point electrical parameters

- Per the applicable device specifications

15

0 reject

Subgroup 5

a.  Salt Atmosphere Test - Mil-Std-883 Method 1009

15

0 reject

b. Visual Inspection - per criteria in Mil-Std-883 Method 1009

15

0 reject

c.  Seal Integrity - Mil-Std-883 Method 1014

1)  Fine Leak Test

2) Gross Leak Test

15

0 reject

Subgroup 6

a.  Internal Water Vapor Content - Mil-Std-883 Method 1018

- 5,000 ppm max water content at 100C

3 (or 5)

0 reject for SS=3;

1 reject for SS=5

Subgroup 7

a.  Adhesion of Lead Finish - Mil-Std-883 Method 2025

15

0 reject

Subgroup 8

a.  Lid Torque Test - Mil-Std-883 Method 2024

5

0 reject

     

Disclaimer: The original document from which the information on this web page were taken, Mil-Std-883 Method 5005, contains many notes that do not appear on this page.  Thus, people are advised to use this web page in conjunction with the original document.   

      

See Also:  Mil-Std-883 Methods;  Mil-PRF-38535 Mil Lot Screen Tests (Method 5004);

Reliability Engineering;  Reliability Tests

   

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