|
Subgroup |
Tests /Conditions |
SS |
Accept # |
|
Subgroup
1
(not
required for Class B)
|
a.
Physical Dimensions - Mil-Std-883 Method 2016
|
2 |
0 reject |
|
b.
Internal Water Vapor Content - Mil-Std-883 Method 1018 |
3 (or 5) |
0 reject
for SS=3;
1 reject
for SS=5 |
|
Subgroup
2
|
a.
Resistance to Solvents - Mil-Std-883 Method 2015
|
3 |
0 reject |
|
b.
Internal Visual Inspection - Mil-Std-883 Method 2010 (not required
for Class B)
|
2 |
0 reject |
|
c.
Bond Strength Test - Mil-Std-883 Method 2011
1)
Thermocompression - Cond. C or D
2)
Ultrasonic or Wedge - Cond. C or D
3)
Flip-chip - Cond. F
4) Beam
Lead - Cond. H
|
Class S
-22 wires;
Class B
-15 wires |
0 reject |
|
d.
Die Shear / Substrate Attach Test - Mil-Std-883 Method 2019 or
2027 (not required for Class B)
|
3 |
0 reject |
|
Subgroup
3
|
a.
Solderability Test - Mil-Std-883 Method 2003
-
soldering temperature of 245 C +/-5 C
|
22 leads |
0 reject |
|
Subgroup
4
(not
required for Class B)
|
a.
Lead Integrity - Mil-Std-883 Method 2004
- test condition B2 (Lead Fatigue)
|
45 |
0 reject |
|
b. Seal
Integrity - Mil-Std-883 Method 1014
1)
Fine Leak Test
2) Gross
Leak Test
|
15 |
0 reject |
|
c.
Lid Torque Test - Mil-Std-883 Method 2024 |
5 |
0 reject |
|
Subgroup
5
(not
required for Class B)
|
a.
End-point electrical parameters
- Per
the applicable device specifications
|
45 |
0 reject |
|
a.
Steady-state Life Test -
Mil-Std-883 Method 1005
- use bias conditions per
device specifications;
- 1000 hours at 125 deg C
or equivalent per Table I of Method 1005
|
45
|
0 reject |
|
c.
End-point electrical parameters
- Per
the applicable device specifications
|
45 |
0 reject |
|
Subgroup
6
(not
required for Class B)
|
a.
End-point electrical parameters
- Per
the applicable device specifications
|
15 |
0 reject |
|
b.
Temperature Cycle - Mil-Std-883 Method 1010
- test
condition C, 100X min.
|
15 |
0 reject |
|
c.
Constant Acceleration - Mil-Std-883 Method
2001- test
condition E min.
|
15 |
0 reject |
|
d. Seal
Integrity - Mil-Std-883 Method 1014
1)
Fine Leak Test
2) Gross
Leak Test
|
15 |
0 reject |
|
e.
End-point electrical parameters
- Per
the applicable device specifications
|
15 |
0 reject |
