|
Method
No.
|
Name
of Method
|
Purpose
|
Equipment
Needed
|
|
1004
|
Moisture
Resistance Test
|
To
evaluate in an accelerated manner the resistance of component parts
and constituents to the effects of high-humidity and heat conditions
|
Uses
temperature/humidity chambers capable of cycling conditions
|
|
1005
|
Steady-State Life Test
|
To
determine the reliability of devices subjected to specified
conditions (standard: 125 deg C with steady-state bias) over an
extended period of time (standard: 1000 hours minimum)
|
Uses
a controlled temperature chamber/oven, power supplies, measuring
devices
|
|
1006
|
Intermittent Life Test
|
To
determine the reliability of devices subjected to specified
conditions that involve cyclical "on-off" variations in electrical
stresses
|
Same as
Method 1005 but electrical excitation must be dynamic
|
|
1008
|
Stabilization
Bake
|
To
determine the effect of storage at elevated temperatures without
electrical stress applied
|
Uses
a controlled temperature chamber/oven
|
|
1009
|
Salt
Atmosphere Test
|
To
serve as an accelerated laboratory corrosion test simulating the
effects of seacoast atmosphere
|
Uses
a salt atmosphere chamber
|
|
1010
|
Temperature
Cycling
|
To
determine the resistance of a part to extremes of high and low
temperatures
|
Uses
a temp cycling chamber capable of providing and controlling temperatures
|
|
1011
|
Thermal
Shock
|
To
determine the resistance of the part to sudden exposures to extreme
changes in temperature and alternate exposures to these extremes
|
Uses
thermal shock equipment capable of providing and controlling
specified temperatures
|
|
1012
|
Thermal
Characteristics
Tests
|
To
determine the thermal characteristics of devices: junction
temperature, thermal resistance, case and mounting temperatures,
thermal response time, etc.
|
Uses a
controlled temperature chamber, thermocouples, electrical
measurement equipment, IR microradiometer, etc.
|
|
1013
|
Dew Point Test
|
To
detect the presence of moisture trapped inside a device package that
may affect device parameters, i.e., leakage current
|
Uses an
equipment that can expose the device to the specified high temp down
to -65 deg C while measuring affected parameters
|
|
1014
|
Hermeticity
Tests
|
To
determine the hermeticity of the seal of devices with internal
cavities
|
Uses
a fine leak tester and a gross leak tester
|
|
1015
|
Burn-in
Test
|
To
eliminate units with marginal defects that can result in early life
failures
|
Uses
a burn-in oven capable of providing high temperature (100-250 deg C) and electrical
stress
|
|
1016
|
Life/Reliability
Characterization Tests
|
To
determine life distributions, life acceleration characteristics, and
failure rate potential of devices
|
Uses
a burn-in oven capable of providing high temperature (200-300 deg C) and electrical
stress
|
|
1018
|
Internal Water Vapor
Content Test
|
To measure
the water vapor content of the atmosphere inside a
hermetically-sealed device
|
Uses
a mass spectrometer or moisture sensor, vacuum chamber, and a
piercing system
|
