MIL-STD-883 Test Methods 2001

MIL-STD-883 Standard Test Methods (Page 2 of 2)

Method No.	Name of Method	Purpose	Equipment Needed
2001	Constant Acceleration	To determine the effects of constant acceleration on microelectronic devices	Uses an apparatus that can apply specified acceleration for the required time
2002	Mechanical Shock	To determine the suitability of devices for use in equipment subjected to moderately severe shocks	Uses an apparatus capable of providing shock pulses of 500 to 30000 g for 0.1 to 1 ms
2003	Solderability Test	To evaluate the solderability of terminations joined by soldering	Uses a solder pot, a dipping mechanism, and a steam ager
2004	Lead Integrity Test	To determine the integrity of microelectronic device leads, welds, and seals	Requires clamps and fixtures to secure the device and attaching weights to the leads
2005/ 2007	Vibration Tests (fatigue/variable frequency)	To determine the effect of vibration on components in the specified frequency range	Uses equipment capable of providing the required vibration at the specified levels
2009	External Visual Inspection	To verify the workmanship of hermetically packaged devices	Uses optical inspection equip- ment capable of 1.5X-10X mag
2010	Internal Visual Inspection	To check the internal materials, construction, and workmanship of microcircuits	Uses optical inspection equipment capable of the specified magnification
2011	Bond Strength Test	To measure bond strengths and evaluate bond strength distributions	Uses equipment capable of applying the specified stress to the bond, lead wire, or terminal
2015	Resistance to Solvents Test	To verify that the markings will not become illegible when the part is subjected to solvents	Uses a vessel made of inert material and of sufficient size to permit complete immersion of specimens in solvents
2016	Physical Dimensions Test	To verify that the external physical dimensions of the device meet the requirements	Uses micrometers, calipers, gauges, contour projectors, etc.
2019	Die Shear Strength Test	To determine the integrity of materials and procedures used to attach semiconductor die	Uses a load-applying instrument with an accuracy of +/-5% of full scale or 50 grams
2020	PIND Test	To detect loose particles inside a device cavity	Uses a Particle Impact Noise Detection (PIND) System
2021	Glassivation Layer Integrity Test	To assess the structural quality of deposited dielectric films or glassivation over the die	Uses a suitable sample handling equipment chemical etching facilities
2024	Lid Torque Test	To determine the shear strength of the seal of glass-frit-sealed packages	Uses an equipment that applies torque to the seal of the sample
2025	Adhesion of Lead Finish Test	To determine the integrity of all primary and undercoat lead finishes	Uses suitable clamps and fixtures for bending stresses to the lead at specified angles

JEDEC Standards; IPC/JEDEC MSL's

HOME