Common Molding-related Failure Mechanisms

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Common Molding-related Failure Mechanisms:

Package cracking - occurrence of fracture anywhere in the package

Package stress-related electrical failure - non-conformance to electrical specifications due to component degradation caused by stresses on the die surface

Wiresweeping - swaying or movement of the wires during molding along the direction of mold flow which may result in broken wires or wire shorting

Package Voids and Pits - imperfections on the package surface (pits) or body (voids) characterized by vacancies of plastic material

Incomplete Filling - insufficient encapsulation resulting when the molding compound fails to fill up the cavity during molding

Blistering - appearance of blisters on the package surface

Package Delamination - any disbonding between the molding compound and another material of the package

Excessive Flashes - presence of unacceptable amounts of plastic on the edges of the package after molding

Solder Voids - exposure of any part of the lead base metal resulting when excess flashes that covered the leads during leadfinish are removed

Mark Permanence Failure - inability of the entirety of an ink mark to remain on the package

Front-End Assembly Links: Wafer Backgrind; Die Preparation; Die Attach; Wirebonding; Die Overcoat

Back-End Assembly Links: Molding; Sealing; Marking; DTFS; Leadfinish

See Also: IC Manufacturing; Assembly Equipment

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