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Package Outlines
MENU:
PDIP;
SOIC/SOJ;
PLCC;
SSOP;
TSOP;
TSSOP;
PQFP;
Plastic Dual In-line Package (PDIP)
The PDIP is one of the most mature plastic IC packages still in use today. It is rectangular in shape and has leads extending from both sides along its length, thus forming two sets of in-line pins. The PDIP comes in two body widths, i.e., 300 mils and 600 mils. Lead count ranges from 8 to 48. The PDIP is a through-hole package, which means that its leads protrude to the other side of the circuit board once mounted. The PDIP is robust and resistant to moisture, but it is also much bulkier than its modern successors.
Table 1. Properties of Some Examples of PDIP's
Small Outline Integrated Circuit (SOIC)/ J-Leaded Small Outline Package (SOJ)
The SOIC is a rectangular surface-mount integrated circuit package with eight or more gull wing leads. The leads protrude from the longer edge of the package. SOIC packages are JEDEC-compliant, and come in a variety of body widths, the most popular of which are 150 mils (narrow body) and 300 mils (wide body). The standard SOIC lead pitch is nominally 50 mils (1.27 mm). The SOIC may be shipped in tubes or tape and reel.
The small outline package may come with J-type leads instead of gull wing leads. Such small outline packages are called SOJ's.
Table 2. Properties of some SOIC's and SOJ's
Plastic Leaded Chip Carrier (PLCC)
The PLCC is a four-sided plastic package that has "J" leads. Lead count ranges from 18 to 84. PLCC packages can either be square or rectangle. PLCC body widths range from .35"to 1.15". PLCCs have JEDEC-standard package outlines. The standard lead pitch of the PLCC is 1.27 mm. The PLCC “J” Lead configuration requires less board space than equivalent gull wing-leaded components.
Table 3. Properties of some PLCC's
Links to other Packages:
PDIP
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