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Package Outlines (Page 2 of 3)
MENU:
PDIP;
SOIC/SOJ;
PLCC;
SSOP;
TSOP;
TSSOP;
PQFP;
Shrink Small Outline Package (SSOP)
The SSOP
package is a smaller or 'shrunk' version of the SOIC package, having a compressed
body and a tightened lead pitch. Lead count ranges from 8 to
64. SSOP body sizes come in 150, 209 and 300 mils. The SSOP package is JEDEC- and
EIAJ- compliant. The package leads are solder plated.
Table 1. Properties of some SSOP's
Part Number
No.
Body
Pitch
Qty
Tape
Tape
Qty
SSOP8
8
5.3mm
.65mm
156
12mm
8mm
2,500
SSOP14/16
14/16
5.3mm
.65mm
100/80
16mm
12mm
1,000
SSOP20/24
20/24
5.3mm
.65mm
66/62
16mm
12mm
1,000
SSOP28
28
5.3mm
.65mm
47
16mm
12mm
1,000
SSOP48
48
7.6mm
1.27mm
30
32mm
12/16mm
1,000
SSOP56
56
7.6mm
1.27mm
26
32mm
12/16mm
500
SSOP64
64
10.2mm
.8mm
—
44mm
16/24mm
500
Thin Small Outline Package (TSOP)
The TSOP
package is rectangular with a thickness of 1.0mm. There are two types of
TSOP's. The Type I TSOP has its leads protruding from the shorter edges of the package. The
Type II TSOP has its leads protruding from the longer edges of the package.
TSOP lead
count ranges from 20 to 48.
TSOP packaging is in JEDEC trays or tape and
reel (quantities may vary).
Table 2a. Properties of some
Type 1 TSOP's
Part Number
No.
Body Size
Lead
Qty
Tape
Tape
Qty
TSOP20/24
20/24
6 x 14.4mm
.5mm
240
24mm
12mm
1,000
TSOP28
28
8.1 x 11.8mm
.55mm
234
24mm
12mm
1,000
TSOP28/32
28/32
8 x 18.4mm
.5mm
156
32mm
12/16mm
1,000
TSOP40
40
10 x 18.4mm
.5mm
120
32mm
16mm
1,000
TSOP48
48
12 x 18.4mm
.5mm
96
32mm
16mm
1,000
Table 2b. Properties of some
Type 2 TSOP's
Part Number
No.
Body Size
Lead
Qty
Tape
Tape
Qty
TSOP20/24/26
20/24/26
7.6 x 17.14mm
1.27mm
176
24mm
12mm
1,000
TSOP24/28
24/28
10.16 x 18.41mm
1.27mm
100
32mm
16mm
1,000
TSOP32
32
10.16 x 20.95mm
1.27mm
117
32mm
16mm
1,000
TSOP40/44
40/44
10.16 x 18.42mm
.8mm
135
32mm
16mm
1,000
TSOP50
50
10.16 x 20.95mm
.8mm
117
32mm
16mm
1,000
TSOP54
54
12.7 x 22.22mm
.8mm
84
44mm
20mm
1,000
TSOP66
66
10.16 x 22.22mm
.65mm
44mm
20mm
1,000
Thin Shrink Small Outline Package (TSSOP)
The TSSOP package has a smaller body and smaller lead pitch than the standard SOIC package. The TSSOP come in body sizes of 3.0mm, 4.4mm and 6.1mm with a thickness of 0.85 mm for the 3.0-mm body and a thickness of 9mm for the 4.4 mm- and 6.1-mm bodies. Lead count ranges from 8 to 56. Its standard lead pitch is 0.65mm. This package type is JEDEC-compliant. The table below shows a partial list of TSSOP package options.
Table 3. Properties of some TSSOP's
Links to other Packages:
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