Package Outlines  (Page 2 of 3)

             

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SOT-23 / SC-70 BGA CSP SIP

      

 

   

Shrink Small Outline Package (SSOP)

The SSOP package is a smaller or 'shrunk' version of the SOIC package, having a  compressed body and a tightened lead pitch. Lead count ranges from 8 to 64. SSOP body sizes come in 150, 209 and 300 mils. The SSOP package is JEDEC- and EIAJ- compliant. The package leads are solder plated.

      

Table 1. Properties of some SSOP's

 

Part Number

No.
of Pins

Body
Width

Pitch

Qty
Per Tube

Tape
Width

Tape
Pitch

Qty
13" Reel

SSOP8

8

5.3mm

.65mm

156

12mm

8mm

2,500

SSOP14/16

14/16

5.3mm

.65mm

100/80

16mm

12mm

1,000

SSOP20/24

20/24

5.3mm

.65mm

66/62

16mm

12mm

1,000

SSOP28

28

5.3mm

.65mm

47

16mm

12mm

1,000

SSOP48

48

7.6mm

1.27mm

30

32mm

12/16mm

1,000

SSOP56

56

7.6mm

1.27mm

26

32mm

12/16mm

500

SSOP64

64

10.2mm

.8mm

44mm

16/24mm

500

    

                                

           

Thin Small Outline Package (TSOP)

The TSOP package is rectangular with a thickness of 1.0mm. There are two types of TSOP's. The Type I TSOP has its leads protruding from the shorter edges of the package. The Type II TSOP has its leads protruding from the longer edges of the package. TSOP lead count ranges from 20 to 48. TSOP packaging is in JEDEC trays or tape and reel (quantities may vary).

      

Table 2a. Properties of some Type 1 TSOP's

Part Number

No.
of Pins

Body Size

Lead
Pitch

Qty
Per Tray

Tape
Width

Tape
Pitch

Qty
13" Reel

TSOP20/24

20/24

6 x 14.4mm

.5mm

240

24mm

12mm

1,000

TSOP28

28

8.1 x 11.8mm

.55mm

234

24mm

12mm

1,000

TSOP28/32

28/32

8 x 18.4mm

.5mm

156

32mm

12/16mm

1,000

TSOP40

40

10 x 18.4mm

.5mm

120

32mm

16mm

1,000

TSOP48

48

12 x 18.4mm

.5mm

96

32mm

16mm

1,000

         

Table 2b. Properties of some Type 2 TSOP's

Part Number

No.
of Pins

Body Size

Lead
Pitch

Qty
Per Tray

Tape
Width

Tape
Pitch

Qty
13" Reel

TSOP20/24/26

20/24/26

7.6 x 17.14mm

1.27mm

176

24mm

12mm

1,000

TSOP24/28

24/28

10.16 x 18.41mm

1.27mm

100

32mm

16mm

1,000

TSOP32

32

10.16 x 20.95mm

1.27mm

117

32mm

16mm

1,000

TSOP40/44

40/44

10.16 x 18.42mm

.8mm

135

32mm

16mm

1,000

TSOP50

50

10.16 x 20.95mm

.8mm

117

32mm

16mm

1,000

TSOP54

54

12.7 x 22.22mm

.8mm

84

44mm

20mm

1,000

TSOP66

66

10.16 x 22.22mm

.65mm

 

44mm

20mm

1,000

    

         

       

Thin Shrink Small Outline Package (TSSOP)

The TSSOP package has a smaller body and smaller lead pitch than the standard SOIC package. The TSSOP come in body sizes of 3.0mm, 4.4mm and 6.1mm with a thickness of 0.85 mm for the 3.0-mm body and a thickness of 9mm for the 4.4 mm- and 6.1-mm bodies. Lead count ranges from 8 to 56. Its standard lead pitch is 0.65mm. This package type is JEDEC-compliant. The table below shows a partial list of TSSOP package options.

      

Table 3. Properties of some TSSOP's

Part Number

No.
of Pins

Body Width

Pitch

Tape
Width

Tape Pitch

Qty
Per Tube

Qty
Per Reel

TSSOP8/10

8/10

3.0mm

.65mm

12mm

8mm

98

2,500

TSSOP14

14

4.4mm

.65mm

12/16mm

8mm

96

1,000/

2,500

TSSOP28

28

4.4mm

.65mm

16mm

8/12mm

50

1,000

TSSOP28/32

28/32

6.1mm

.65mm

24mm

12mm

50/44

1,000

TSSOP38

38

6.1mm

.65mm

24mm

12mm

39

1,000

TSSOP48/56

48/56

6.1mm

.5mm

24mm

12mm

39/35

1,000

TSSOP56

56

4.4mm

.4mm

24mm

12mm

42

1,000

TSSOP64

64

6.1mm

.5mm

N/A

N/A

28

N/A

TSSOP80

80

6.1mm

.4mm

N/A

N/A

28

N/A

                         

               

Links to other Packages:

          

PDIP      SOIC/SOJ     PLCC    SSOP    TSOP    TSSOP

PQFP    SOT-23 / SC-70     BGA     CSP      SIP    

         

  

 

   

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