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Learning
from Test/QA/FA/Rel Technical Papers
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Technical
papers constitute a major resource for learning about semiconductor
manufacturing and engineering. Below are some findings from
technical papers that engineers can benefit from.
Test
/ Back-end
Electrical
Test
Resolving Product Test Handler Jamming and Over-rejection Through Assembly Lead Forming Tool Modification
Contactor Failure Characterization in Device Testing
Back-End
Tape and Reel Over-rejection Problem Elimination Through Modified Carrier Tape Design
Back-end Test Flow Simplification Through Class Test at Sort (CTAS) Approach
Quality Assurance
Dodge Skip Sampling: A Cost-Effective Plan for a Statistically Based Sample Size Reduction
The Determination of Gauge Repeatability for Destructive Tests
Effect of Equipment Design on Die Shear Strength Variability
Failure Analysis /
Reliability
Failure Analysis
Die Backside Fault Isolation Approach in Micro-Ball Grid Array Package
Failure Analysis Approach on Margin Delta Failures in Stacked Chip Scale Package
Resolution of Pin#17 Broken Wire Customer Complaint
Failure Analysis of Assembly and Test Process-Induced Die Cracks in Thin Plastic Package
Understanding Protective Overcoat Damages: Failure Analysis to the Next Level
Reliability
Delamination in Plastic Package
Effects of Mold Compound Properties on Lead-on-Chip (LOC) Package Reliability During IR Reflow
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