Industry-Standard Reliability Tests    

   

Reliability Test 

Reference Specs

Purpose

Conditions

Solder Heat Resistance Test (SHRT)

JEDEC JESD22-A113;

 

JEDEC

J-STD-020 

To determine the ability of the part to withstand the customer's board mounting process; also used as preconditioning for other reliability tests

Steps:

- 24-H Bake at 125C

- Temperature/Humidity Soak based on the MSL of the part

- 3X IR Reflow at the prescribed peak temperature (about 235C for non-Pb-free parts; 260C for Pb-free parts) 

      

Temperature Cycle

Mil-Std-883 Method 1010;

 

JEDEC JESD22-A104 

To determine the resistance of a part to extremes of high and low temperatures; as well as its ability to withstand cyclical stresses

Mil Std 883 Method 1010:

- Must be conducted for a minimum of 10 cycles

-  Condition A: -55 (+0/-10) C to 85 (+10,-0) C

-  Condition B: -55 (+0/-10) C to 125 (+15,-0) C

-  Condition C: -65 (+0/-10) C to 150 (+15,-0) C

-  Condition D: -65 (+0/-10) C to 200 (+15,-0) C

-  Condition E: -65 (+0/-10) C to 300 (+15,-0) C

-  Condition F: -65 (+0/-10) C to 175 (+15,-0) C",

-  Total Transfer Time <= 1 minute

-  Total Dwell Time >= 10 minutes

-  Specified Temp reached in <= 15 minutes

     

JEDEC JESD22-A104:

-  Recommended for lot acceptance screen :  10 cycles

-  Recommended for qualification:  1000 cycles

-  Condition A: -55 (+0/-10) C to 85 (+10,-0) C

-  Condition B: -55 (+0/-10) C to 125 (+10,-0) C

-  Condition C: -65 (+0/-10) C to 150 (+10,-0) C

-  Condition D: -65 (+0/-10) C to 200 (+10,-0) C

-  Condition F: -65 (+0/-10) C to 175 (+10,-0) C

-  Condition G: -40 (+0/-10) C to 125 (+10,-0) C

-  Condition H: -55 (+0/-10) C to 150 (+10,-0) C

-  Total Transfer Time <= 1 minute

-  Total Dwell Time >= 10 minutes

-  Specified Temp reached in <= 15 minutes  

     

Thermal Shock

Mil-Std-883 Method 1011;

   

JEDEC JESD22-A106 

 

To determine the resistance of the part to sudden exposures to extreme changes in temperature and alternate exposures to these extremes; as well as its ability to withstand cyclical stresses

Mil Std 883 Method 1011: 

-  Must be conducted for a minimum of 15 cycles

-  Condition A:  0 (+2/-10) C to 100 (+10/-2) C

-  Condition B: -55 (+0/-10) C to 125 (+10,-0) C

-  Condition C: -65 (+0,-10) C to 150 (+10,-0) C

-  Total Transfer Time < 10 seconds

-  Total Dwell Time > 2 minutes

-  Specified Temp reached in < 5 minutes

  

JEDEC JESD22-A106:

-  Must be conducted for a minimum of 15 cycles

-  Condition A:  -40 (+0/-30) C to 85 (+10/-0) C

-  Condition B: -0 (+2/-10) C to 100 (+10,-2) C

-  Condition C: -55 (+0,-10) C to 125 (+10,-0) C

-  Condition D: -65 (+0,-10) C to 150 (+10,-0) C

-  Total Transfer Time < 10 seconds

-  Total Dwell Time > 2 minutes

-  Specified Temp reached in < 5 minutes

           

Autoclave or Pressure Cooker Test (PCT)

JEDEC

JESD22-A102

To assess the ability of a product to withstand severe temperature and humidity conditions; used primarily to accelerate corrosion in the metal parts of the product

     

- Preconditioned

- Soak at 121C/100% RH for 168 Hrs 

- Pressure = 2 atm

- Unbiased

 

Highly Accelerated Stress Test (HAST)

JEDEC

JESD22-A110

To  accelerate metal corrosion, particularly that of the metallizations on the die surface of the device

- Preconditioned

- Soak at 130C/85% RH for 96 to 100 Hrs 

- Biased

 

Burn-in

Mil-Std-883 Method 1015;

 

JEDEC

JESD22-A108

 

 

To eliminate units with marginal defects that can result in early life failures;

To determine the high temp operating lifetime of a population

Early Life Burn-in: 

- Biased bake at Tj=125C for 48 to 168 hours

HTOL:

- Biased bake at Tj=125C for 500 to 1000 hours

 

Temp Humidity Bias (THB) Test

JEDEC

JESD22-A101

To  accelerate metal corrosion, particularly that of the metallizations on the die surface of the device

- Preconditioned

- Soak at 85C/85% RH for 1000 Hrs 

- Biased

 

High Temperature Storage (HTS)/ Stabilization Bake

 

Mil-Std-883 Method 1008

To  determine the effect on devices of storage at elevated temperatures without any electrical stresses applied

HTS Conditions:

- Bake at 150C for 1000 Hrs

- Unbiased

Stabilization Bake Conditions:

- Duration: 24 Hrs unless otherwise stated

- Test Cond. A: 75 deg C

- Test Cond. B: 125 deg C

- Test Cond. C:

     - 1000H at 100 deg C

     - 168H at 125 deg C

     - 24H at 150 deg C

     - 20H at 155 deg C

     - 16H at 160 deg C

     - 12H at 165 deg C

     - 8H at 170 deg C

     - 6H at 175 deg C

     - 4H at 200 deg C

- Test Cond. D: 200 deg C

- Test Cond. E: 250 deg C

- Test Cond. F: 300 deg C

- Test Cond. G: 350 deg C

- Test Cond. H: 400 deg C

  

 

   

See Also:  Reliability Engineering;  JEDEC Standards;  MIL-STD Test Methods;

IPC/JEDEC MSL's

 

 

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