Amkor was the first semiconductor manufacturer to implement a high-density pre-singulation test process for many common IC packages, having achieved this by utilizing its high-density leadframe (HDLF) assembly technology in high-parallelism testing. Amkor has been doing matrix testing in volume production since February, 1999.

According to Amkor, the benefits of strip testing include:

- reduced cost of test primarily from high degree of parallelism;

- reduced cycle time from testing in line with assembly;

- consistently higher yields than singulated test (better contact methodology);

- higher quality from reduced handling (reduced bent leads);

- faster time for test development;

- part traceability to assembly;

- high strip density (up to 400 devices per strip);

- reduced floor space;

- better equipment utilization;

- significant reduction in test capital expenditures;

- immediate feedback to assembly.

Figure 1. Example of a Handler System used in Strip Testing

Strip testing, like any technology, has its own disadvantages. For one, it requires heavy reengineering of existing lines for its effective adaptation.   Secondly, assembly-test integration loses some of the flexibility offered by having both processes independent of each other. An assembly house that already has hundreds of different package configurations and sizes would have second thoughts about re-engineering its assembly production floor so that it can be integrated into a new strip-test process.