The
TO-267
is
a
type of "transistor outline" package that features a metallic
body with a flat metal tab at its back (see Figure 1) to enable it to dissipate large amounts
of heat.
The TO-267 looks very similar to the TO-257, but
it is larger than the latter.
The
TO-267 is hermetically sealed to protect
the device from environmental factors such as contaminants and moisture.
The leads protrude from the bottom of the package through glass and
ceramic feed-throughs that insulate them from the metal body.
The TO-267 is
commonly used for housing
transistors, thyristors, and
integrated circuits with low lead counts such as voltage regulators
that are
intended for high-reliability and mission-critical circuits.
The metal tab at the back of the TO-267 serves as a heat sink itself,
but it has a hole so that it can be screwed onto a larger heat sink if
higher power handling capability is required.
A typical TO-267 package has 3
leads, although TO-267's with other lead counts may be encountered. The typical lead pitch (distance between leads) of a
3-lead TO-267 package is 5.08 mm.
