TSSOP - Thin Shrink Small Outline Package

                                                  

The Thin Shrink Small Outline Package, or TSSOP, is a rectangular surface mount plastic package with gull-wing leads. It has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count.

 

The TSSOP come in body sizes of 3.0mm, 4.4mm and 6.1mm. The 3.0-mm TSSOP body has a typical thickness of 0.85 mm while the 4.4 mm- and 6.1-mm bodies have a typical thickness of 0.9 mm. TSSOP lead counts range from 8 to 56. The standard lead pitch used by TSSOP's is 0.65mm. This package type is JEDEC-compliant. The table below shows a partial list of TSSOP package options.

      

Table 1. Properties of some TSSOP's

Part Number

No.
of Pins

Body Width

Pitch

Tape
Width

Tape Pitch

Qty
Per Tube

Qty
Per Reel

TSSOP8/10

8/10

3.0mm

.65mm

12mm

8mm

98

2,500

TSSOP14

14

4.4mm

.65mm

12/16mm

8mm

96

1,000/

2,500

TSSOP28

28

4.4mm

.65mm

16mm

8/12mm

50

1,000

TSSOP28/32

28/32

6.1mm

.65mm

24mm

12mm

50/44

1,000

TSSOP38

38

6.1mm

.65mm

24mm

12mm

39

1,000

TSSOP48/56

48/56

6.1mm

.5mm

24mm

12mm

39/35

1,000

TSSOP56

56

4.4mm

.4mm

24mm

12mm

42

1,000

TSSOP64

64

6.1mm

.5mm

N/A

N/A

28

N/A

TSSOP80

80

6.1mm

.4mm

N/A

N/A

28

N/A

                  

Figure 1.  Examples of TSSOP's (not in scale with each other)

      

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