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Bonding Wires
(Page 2 of 2)
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Table 3. Examples of Bonding Wires
from Mitsubishi Materials
|
Type |
Diameter (um) |
Weight (mg/20cm) |
Breaking Strength (g) |
Elongation (%) |
|
MGS-20 |
20+/-1 |
1.1-1.34 |
3-7 |
2-7 |
|
MGS-23 |
23+/-1 |
1.46-1.75 |
4-8 |
2-7 |
|
MGS-25 |
25+/-1 |
1.75-2.05 |
7-11 |
2-7 |
|
MGS-28 |
28+/-1 |
2.21-2.55 |
8-13 |
2-7 |
|
MGS-30 |
30+/-1 |
2.55-2.92 |
10-15 |
2-7 |
|
MGS-32 |
32+/-1 |
2.92-3.3 |
12-17 |
2-7 |
|
MGS-35 |
35+/-1 |
3.5-3.93 |
13-20 |
2-8 |
|
MGS-38 |
38+/-1 |
4.15-4.61 |
15-26 |
2-8 |
|
MGS-40 |
40+/-1 |
4.31-5.35 |
17-30 |
2-8 |
|
MGS-50 |
50+/-1 |
6.98-8.2 |
30-50 |
2-10 |
Table 4. Examples of
Bonding Wires from Tanaka
|
Wire
Type |
Manufacturer's Description |
|
GMG and GMH Gold Wires |
Have
greater strength and resistance to vibration than conventional
products; long loops (4 mm and more) and very short loops (1 mm or
less) are more reliable, providing finer pitch and reduced costs |
|
GPG Gold
Alloy Wires |
Finer
wire due to superior mechanical strength; greater bonding
strength; smaller deformed ball diameter; high bonding
reliability; can be used with conventional ball bonders |
|
TABW
Aluminum-1%Silicon Wires |
Stable
quality with no curls or blemishes; excellent purity, with no gas
oxide absorption; ideal for hermetically sealed packaging where
high reliability is demanded |
|
TANW
Power Aluminum Wires |
Improved
anti-corrosive properties; smooth, clean, unscratched surfaces;
high purity with good bonding properties |
Table 5. Examples of
Bonding Wires from K&S/AFW
|
Wire
Type |
Manufacturer's Description |
|
AW-21 |
Gold
wire for high loop applications, i.e., discrete and high-power
components |
|
AW-29 |
Gold
wire for standard loop applications, e.g., SOT, DIP, SOP, PLCC |
|
AW-14 |
Gold
wire for low loop applications, e.g., QFP, TSOP, TSSOP, TQFP, BGA,
PGA |
|
AW-99 |
Gold
wire for advanced fine-pitched packages |
|
AW-6 |
Gold
alloy bumping wire for stacked as well as other applications where
elimination of coining and precision are key requirements |
|
FP-2 |
Gold
alloy wire; high tensile strength for enhanced reliability |
|
ALW-29C |
Aluminum
wire; corrosion-resistant for wedge bonding |
|
ALW-29S |
Aluminum-1% Si wire; small-diameter aluminum wedge bonding wire |
|
ALW-49P |
Aluminum
high-purity wedge bonding wire |
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See Also:
Semiconductor
Matls; IC
Manufacturing; Wirebonding
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